Sign in to use this feature.

Years

Between: -

Subjects

remove_circle_outline
remove_circle_outline

Journals

Article Types

Countries / Regions

Search Results (2)

Search Parameters:
Keywords = CSTBT

Order results
Result details
Results per page
Select all
Export citation of selected articles as:
10 pages, 4042 KB  
Article
A Novel High-Speed Split-Gate Trench Carrier-Stored Trench-Gate Bipolar Transistor with Enhanced Short-Circuit Roughness
by Zhehong Qian, Wenrong Cui, Tianyang Feng, Hang Xu, Yafen Yang, Qingqing Sun and David Wei Zhang
Micromachines 2024, 15(6), 680; https://doi.org/10.3390/mi15060680 - 22 May 2024
Cited by 1 | Viewed by 1762
Abstract
A novel high-speed and process-compatible carrier-stored trench-gate bipolar transistor (CSTBT) combined with split-gate technology is proposed in this paper. The device features a split polysilicon electrode in the trench, where the left portion is equipotential with the cathode. This design mitigates the impact [...] Read more.
A novel high-speed and process-compatible carrier-stored trench-gate bipolar transistor (CSTBT) combined with split-gate technology is proposed in this paper. The device features a split polysilicon electrode in the trench, where the left portion is equipotential with the cathode. This design mitigates the impact of the anode on the trench gate, resulting in a reduction in the gate-collector capacitance (CGC) to improve the dynamic characteristics. On the left side of the device cell, the P-layer, the carrier-stored (CS) layer and the P-body are formed from the bottom up by ion implantation and annealing. The P-layer beneath the trench bottom can decrease the electric field at the bottom of the trench, thereby improving breakdown voltage (BV) performance. Simultaneously, the highly doped CS layer strengthens the hole-accumulation effect at the cathode. Moreover, the PNP doping layers on the left form a self-biased pMOS. In a short-circuit state, the self-biased pMOS turns on at a certain collector voltage, causing the potential of the CS-layer to be clamped by the hole channel. Consequently, the short-circuit current no longer increases with the collector voltage. The simulation results reveal significant improvements in comparison with the conventional CSTBT under the same on-state voltage (1.48 V for 100 A/cm2). Specifically, the turn-off time (toff) and turn-off loss (Eoff) are reduced by 38.4% and 41.8%, respectively. The short-circuit current is decreased by 50%, while the short-circuit time of the device is increased by 2.46 times. Full article
(This article belongs to the Special Issue Insulated Gate Bipolar Transistor (IGBT) Modules)
Show Figures

Figure 1

12 pages, 6065 KB  
Article
A Performance Optimized CSTBT with Low Switching Loss
by Hang Xu, Tianyang Feng, Wenrong Cui, Yafen Yang and David Wei Zhang
Micromachines 2023, 14(5), 1039; https://doi.org/10.3390/mi14051039 - 12 May 2023
Cited by 2 | Viewed by 2844
Abstract
A novel Performance Optimized Carrier Stored Trench Gate Bipolar Transistor (CSTBT) with Low Switching Loss has been proposed. By applying a positive DC voltage to the shield gate, the carrier storage effect is enhanced, the hole blocking capability is improved and the conduction [...] Read more.
A novel Performance Optimized Carrier Stored Trench Gate Bipolar Transistor (CSTBT) with Low Switching Loss has been proposed. By applying a positive DC voltage to the shield gate, the carrier storage effect is enhanced, the hole blocking capability is improved and the conduction loss is reduced. The DC biased shield gate naturally forms inverse conduction channel to speed up turn-on period. Excess holes are conducted away from the device through the hole path to reduce turn-off loss (Eoff). In addition, other parameters including ON-state voltage (Von), blocking characteristic and short circuit performance are also improved. Simulation results demonstrate that our device exhibits a 35.1% and 35.9% decrease in Eoff and turn-on loss (Eon), respectively, in comparison with the conventional shield CSTBT (Con-SGCSTBT). Additionally, our device achieves a short-circuit duration time that is 2.48 times longer. In high-frequency switching applications, device power loss can be reduced by 35%. It should be noted that the additional DC voltage bias is equivalent to the output voltage of the driving circuit, enabling an effective and feasible approach towards high-performance power electronics applications. Full article
(This article belongs to the Special Issue Semiconductor Power Devices: Reliability and Applications)
Show Figures

Figure 1

Back to TopTop