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Keywords = CIP/ABS composites

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13 pages, 5803 KiB  
Article
Effects of Carbonyl Iron Powder (CIP) Content on the Electromagnetic Wave Absorption and Mechanical Properties of CIP/ABS Composites
by Wenwen Lai, Yan Wang and Junkun He
Polymers 2020, 12(8), 1694; https://doi.org/10.3390/polym12081694 - 29 Jul 2020
Cited by 35 | Viewed by 4596
Abstract
Three-dimensional (3D) printing technology has proven to be a convenient and effective method to fabricate structural electromagnetic wave (EMW) absorbers with tunable EMW absorption properties. To obtain a functional material with strong EMW absorbing performance and excellent mechanical properties for fused deposition modeling [...] Read more.
Three-dimensional (3D) printing technology has proven to be a convenient and effective method to fabricate structural electromagnetic wave (EMW) absorbers with tunable EMW absorption properties. To obtain a functional material with strong EMW absorbing performance and excellent mechanical properties for fused deposition modeling (FDM) 3D printing technology, in this work, carbonyl iron powder (CIP)/acrylonitrile-butadiene-styrene copolymer (ABS) composites with different CIP contents were prepared by the melt-mixing process. The effects of the CIP content on the EMW absorption and mechanical properties of CIP/ABS composites were investigated. The CIP/ABS composite with a CIP content of 40 wt.% presented the lowest reflection loss (RL) of −48.71 dB for the optimal impedance matching. In addition, this composite exhibited optimal mechanical properties due to the good dispersion of the CIPs in the matrix ABS. Not only were the tensile and flexural strength similar to pure ABS, but the tensile and flexural modulus were 32% and 37% higher than those of pure ABS, respectively. With a CIP content of 40 wt.%, the CIP/ABS composite proved to be a novel functional material with excellent EMW absorbing and mechanical properties, providing great potential for the development of structural absorbers via FDM 3D printing technology. Full article
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