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Keywords = ΔE-E telescope

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13 pages, 3905 KiB  
Review
Bonding Processing and 3D Integration of High-Performance Silicon PIN Detector for ΔE-E telescope
by Zhiyuan Zhu, Maoqiu Pu, Min Jiang, Sixiang Zhang and Min Yu
Processes 2023, 11(2), 627; https://doi.org/10.3390/pr11020627 - 18 Feb 2023
Cited by 2 | Viewed by 2493
Abstract
Currently, the integration method of silicon PIN radiation detectors faces challenges such as complex processes, poor reliability and thick dead layers. Novel integration methods based on metal bonding technology for realizing the integration of thick and thin PIN detectors are needed with the [...] Read more.
Currently, the integration method of silicon PIN radiation detectors faces challenges such as complex processes, poor reliability and thick dead layers. Novel integration methods based on metal bonding technology for realizing the integration of thick and thin PIN detectors are needed with the requirement of reducing signal crosstalk, package volume and weight. Combined with the current research on metal bonding technology, this paper presents an extensive review of metal bonding technology, especially metal Al bonding technology, to provide a certain reference to future research on the bonding processing of high-performance silicon PIN detector devices. Full article
(This article belongs to the Section Automation Control Systems)
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