Study of the Transcription Effects of Pressing Dies with Ultrasonic Polishing on Glass Molding
Abstract
:1. Introduction
2. Methods
2.1. Optical Design
2.2. Pressing Die of Glass Molding
2.3. Material
2.4. Glass Molding Process
2.5. Evaluating the Precision of Pressing Dies and Transcription Effects in the Glass Molding
3. Results
3.1. The Transcription Effects of Temperature and Pressing Force on the Surface Roughness of MLA
3.2. Polishing Effects with or without Ultrasonic Polishing on Surface Roughness and Material Removal
3.3. Polishing Effects of Diamond Abrasive on the Surface Roughness and Material Removal
3.4. Transcription Effects of the Pressing Dies
4. Conclusions
- Excellent transcription effects could be obtained when the parameter of the pressing force was 250 N and the working temperature was set to 690 °C, whereby the transcription ratio of the pressing die topography to the MLA surface could reach 99% in PGM.
- The die surface with ultrasonic polishing was smoother and could produce a larger amount of material removal than the die surface without ultrasonic finishing. According to the results, the RIR with ultrasonic polishing of the pressing die could reach 90% when using the abrasive of mesh #8000, whereas the RIR without ultrasonic finishing of the pressing die only yielded a low value of 33%.
- The MLA made using the pressing die with a surface roughness 0.08 µm Ra could not transform the Gauss-distributed spotlight into a uniform straight line by virtue of its poor transparency. However, the MLA made using the pressing die with a surface roughness of 0.023 µm Ra in PGM achieved a uniform straight line from the Gauss spotlight emitted by the laser pen.
- The temperature and pressure are the key parameters of the glass molding. In this study, the MLA stuck easily to the pressing die at a high temperature (over 690 °C), whereas a low temperature and low pressure in PGM could induce a bad transcription effect, and the MLA was ruptured at high pressure (270 N).
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
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Physical Properties | Parameters |
---|---|
Glass transition temperature, Tg (°C) | 564 |
Thermal expansion coefficient (ppm/K) | 9.5 |
Refractive index at 20 °C (nD) | 1.52 |
Dispersion at 20 °C, 140 × (nF − nC) | 87.7 |
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Cheng, K.-C.; Huang, C.-Y.; Hung, J.-C.; Wang, A.-C.; Lin, Y.-C. Study of the Transcription Effects of Pressing Dies with Ultrasonic Polishing on Glass Molding. Processes 2021, 9, 2083. https://doi.org/10.3390/pr9112083
Cheng K-C, Huang C-Y, Hung J-C, Wang A-C, Lin Y-C. Study of the Transcription Effects of Pressing Dies with Ultrasonic Polishing on Glass Molding. Processes. 2021; 9(11):2083. https://doi.org/10.3390/pr9112083
Chicago/Turabian StyleCheng, Ken-Chuan, Chien-Yao Huang, Jung-Chou Hung, A-Cheng Wang, and Yan-Cherng Lin. 2021. "Study of the Transcription Effects of Pressing Dies with Ultrasonic Polishing on Glass Molding" Processes 9, no. 11: 2083. https://doi.org/10.3390/pr9112083
APA StyleCheng, K.-C., Huang, C.-Y., Hung, J.-C., Wang, A.-C., & Lin, Y.-C. (2021). Study of the Transcription Effects of Pressing Dies with Ultrasonic Polishing on Glass Molding. Processes, 9(11), 2083. https://doi.org/10.3390/pr9112083