Li, R.; Wei, W.; Cao, T.; Chen, R.; Li, J.; Lai, Y.; Liu, H.; Geng, X.; Liu, F.; Li, W.
Prediction of the Contact Behavior of Stepseals: Experimental and Numerical Investigations. Processes 2024, 12, 2212.
https://doi.org/10.3390/pr12102212
AMA Style
Li R, Wei W, Cao T, Chen R, Li J, Lai Y, Liu H, Geng X, Liu F, Li W.
Prediction of the Contact Behavior of Stepseals: Experimental and Numerical Investigations. Processes. 2024; 12(10):2212.
https://doi.org/10.3390/pr12102212
Chicago/Turabian Style
Li, Ran, Wenshu Wei, Tianze Cao, Rongming Chen, Jianfeng Li, Yuehua Lai, Hao Liu, Xiangyu Geng, Fengcai Liu, and Wenbo Li.
2024. "Prediction of the Contact Behavior of Stepseals: Experimental and Numerical Investigations" Processes 12, no. 10: 2212.
https://doi.org/10.3390/pr12102212
APA Style
Li, R., Wei, W., Cao, T., Chen, R., Li, J., Lai, Y., Liu, H., Geng, X., Liu, F., & Li, W.
(2024). Prediction of the Contact Behavior of Stepseals: Experimental and Numerical Investigations. Processes, 12(10), 2212.
https://doi.org/10.3390/pr12102212
