Liu, Y.; Gong, W.; Liu, X.; Fan, Y.; He, A.; Nie, H.
Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride. Polymers 2024, 16, 1169.
https://doi.org/10.3390/polym16081169
AMA Style
Liu Y, Gong W, Liu X, Fan Y, He A, Nie H.
Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride. Polymers. 2024; 16(8):1169.
https://doi.org/10.3390/polym16081169
Chicago/Turabian Style
Liu, Yongjia, Weiheng Gong, Xingjian Liu, Yicheng Fan, Aihua He, and Huarong Nie.
2024. "Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride" Polymers 16, no. 8: 1169.
https://doi.org/10.3390/polym16081169
APA Style
Liu, Y., Gong, W., Liu, X., Fan, Y., He, A., & Nie, H.
(2024). Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride. Polymers, 16(8), 1169.
https://doi.org/10.3390/polym16081169