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Journal: Polymers, 2023
Volume: 15
Number: 2073
Article:
Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes
Authors:
by
Ruoqing Zhao, Hao Wu, Xuan Dong, Manzhang Xu, Zhenhua Wang and Xuewen Wang
Link:
https://www.mdpi.com/2073-4360/15/9/2073
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