Zhao, R.; Wu, H.; Dong, X.; Xu, M.; Wang, Z.; Wang, X.
Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes. Polymers 2023, 15, 2073.
https://doi.org/10.3390/polym15092073
AMA Style
Zhao R, Wu H, Dong X, Xu M, Wang Z, Wang X.
Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes. Polymers. 2023; 15(9):2073.
https://doi.org/10.3390/polym15092073
Chicago/Turabian Style
Zhao, Ruoqing, Hao Wu, Xuan Dong, Manzhang Xu, Zhenhua Wang, and Xuewen Wang.
2023. "Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes" Polymers 15, no. 9: 2073.
https://doi.org/10.3390/polym15092073
APA Style
Zhao, R., Wu, H., Dong, X., Xu, M., Wang, Z., & Wang, X.
(2023). Enhancing the Toughness of Free-Standing Polyimide Films for Advanced Electronics Applications: A Study on the Impact of Film-Forming Processes. Polymers, 15(9), 2073.
https://doi.org/10.3390/polym15092073