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Journal: PolymersVolume: 15Number: 3083
Article: The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages
  • Authors:
  • Hyun-Seok Choi*,
  • Jeong-Hyun Park and
  • Jong-Hee Lee
Link: https://www.mdpi.com/2073-4360/15/14/3083

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