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Journal: Polymers, 2023
Volume: 15
Number: 3083
Article:
The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages
Authors:
by
Hyun-Seok Choi, Jeong-Hyun Park and Jong-Hee Lee
Link:
https://www.mdpi.com/2073-4360/15/14/3083
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