The main purpose of this paper was to determine the effect of biochemical modification of epoxy adhesive compounds on the mechanical properties of hot-dip galvanized steel sheet DX51+Z275 adhesive joints. The epoxy adhesives (resin and curing agent) were biochemically modified by lyophilized fungal metabolites (in the form of lyophilized fungal fractions or materials preparation containing low molecular weight secondary metabolites of lignocellulose-degrading white rot fungi (WRF) Pycnoporus sanguineus
and prepared by two methods). The epoxy adhesives (epoxy resin Epidian 53 and poliaminoamide curing agent PAC) were biochemical modified by lyophilized fungal metabolites and prepared by two methods. In the first method (Method I), the epoxy resin and the curing agent were mixed with the fungal material in the desired concentration. In the second method (Method II), the resin was mixed with mortar-grounded lyophilized post-culture liquid of the desired concentration and after following thorough mixing, a suitable amount of the poliaminoamide curing agent was added. The single-lap adhesive joints were prepared by modified epoxy adhesive compounds and were cured in various climatic factors. The specimens of adhesive joints were cured at single stage at the same temperature and humidity as during adhesive bonding (Variant A and Variant B). At the second stage, Method I adhesive joints were seasoned for two months at the temperature of 50 °C and 50% humidity in a climate test chamber (Variant C). The shear strength tests of the single-lap adhesive joints were performed using a Zwick/Roell Z150 testing machine in accordance with the DIN EN 1465 standard. The analysis of results revealed that the addition of the biological modifier can lead to reduced adhesive joint strength in ambient conditions, yet at elevated temperature and the higher humidity it results in a significant increase in adhesive joint strength.
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