Next Article in Journal
Switchable Liquid Crystal Contact Lenses for the Correction of Presbyopia
Previous Article in Journal
Sigma-Holes in Battery Materials Using Iso-Electrostatic Potential Surfaces
Article Menu
Issue 1 (January) cover image

Export Article

Open AccessArticle
Crystals 2018, 8(1), 32; https://doi.org/10.3390/cryst8010032

Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon

1
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
2
School of Mechanical and Electrical Engineering, Xiamen University Tan Kah Kee College, Zhangzhou 363105, China
*
Authors to whom correspondence should be addressed.
Received: 22 December 2017 / Revised: 4 January 2018 / Accepted: 5 January 2018 / Published: 12 January 2018
Full-Text   |   PDF [5903 KB, uploaded 12 January 2018]   |  

Abstract

The effect of abrasive shape on the three-body abrasion behaviors of monocrystalline silicon was investigated via molecular dynamics. The axial ratio of abrasive particle varied from 1.00 to 0.40 to mimic abrasive shape. It has been observed that the particle’s movement became sliding instead of rolling when the axial ratio was smaller than a critical value 0.46. In the abrasion process, the friction force and normal force showed an approximately sinusoid-like fluctuation for the rolling ellipsoidal particles, while the front cutting of particle caused that friction force increased and became larger than normal force for sliding particles. The phase transformation process was tracked under different particle’ movement patterns. The Si-II and Bct5 phase producing in loading process can partially transform to Si-III/Si-XII phase, and backtrack to original crystal silicon under pressure release, which also occurred in the abrasion process. The secondary phase transformation showed difference for particles’ rolling and sliding movements after three-body abrasion. The rolling of particle induced the periodical and inhomogeneous deformation of substrates, while the sliding benefited producing high-quality surface in chemical mechanical polishing (CMP) process. This study aimed to construct a more precise model to understand the wear mechanism benefits evaluating the micro-electro-mechanical systems (MEMS) wear and CMP process of crystal materials. View Full-Text
Keywords: three-body abrasion; phase transformation; monocrystalline silicon; abrasive shape; molecular dynamics three-body abrasion; phase transformation; monocrystalline silicon; abrasive shape; molecular dynamics
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

Supplementary material

SciFeed

Share & Cite This Article

MDPI and ACS Style

Shi, J.; Wei, X.; Chen, J.; Sun, K.; Fang, L. Influence of Abrasive Shape on the Abrasion and Phase Transformation of Monocrystalline Silicon. Crystals 2018, 8, 32.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Crystals EISSN 2073-4352 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top