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Journal: Crystals, 2017
Volume: 7
Number: 255
Article:
Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation
Authors:
by
Naoya Tada, Takuhiro Tanaka, Takeshi Uemori and Toshiya Nakata
Link:
https://www.mdpi.com/2073-4352/7/8/255
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