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Journal: Crystals, 2017
Volume: 7
Number: 255

Article: Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation
Authors: by Naoya Tada, Takuhiro Tanaka, Takeshi Uemori and Toshiya Nakata
Link: https://www.mdpi.com/2073-4352/7/8/255

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