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Journal: J. Theor. Appl. Electron. Commer. Res., 2024
Volume: 19
Number: 112
Article:
Direct Mail or Bonded Warehouse? Logistics Mode Selection in Cross-Border E-Commerce under Exchange Rate Risk
Authors:
by
Xiaoyi Li, Hui Yu and Caihong Sun
Link:
https://www.mdpi.com/0718-1876/19/3/112
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