Conferences

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Conference Month
 

Upcoming MDPI Conferences (1)

25–27 September 2024 ICM 2024 – Advances in Material Innovation

Basel, Switzerland

We are delighted to announce the 5th International Conference of Materials – Advances in Material Innovation, scheduled to take place in Basel, Switzerland, from September 25–27, 2024.

The goal of this conference is to unite leading scientists, researchers, and industry experts worldwide, facilitating the exchange of insights on recent advancements in Materials Characterization, Processing, and Manufacturing. The focus areas include Nanotechnology in Material Sciences and Engineering, Optical, Electrical, and Magnetic Materials, Soft, Biological, and Bio-materials, Fibers, Membranes, and Thin film, Sensing Materials, as well as Materials and devices for energy and solar fuels. Additionally, discussions on the integration of AI and ML in Material research will be featured.

The event is sponsored by MDPI and the open-access journal MaterialsFollowing three successful editions in electronic format, the 2022 conference was held in Barcelona, Spain. We anticipate that the conference will offer attendees a unique opportunity to stay informed about the latest research and to connect with colleagues from around the world.

Although the call for abstracts is now closed, you can still be part of this amazing conference. Register today and keep up with the latest trends and insights in materials science! Early Bird fees are valid until 15 July 2024.

And there's more: interested parties can still submit in the poster category. For details, simply email us at [email protected].



For further details about the conference, please click here to visit the website.

We look forward to welcoming you in Basel!

Sincerely,

Prof. Dr. Maryam Tabrizian and Prof. Dr. Federico Bella
ICM2024 Chairs

https://sciforum.net/event/ICM2024

Conference Year
Conference Month
 

Upcoming Partner Conferences (2)

24–26 September 2024 Materials Science and Engineering Congress 2024

Darmstadt, Germany

MDPI will be attending the Materials Science and Engineering Congress 2024, which will be held from 24 to 26 September 2024 in Darmstadt, Germany. This event is organized by the German Society for Materials Science (DGM), which is the largest scientific and technical society in the field of materials science and engineering in Germany.

The areas of focus for the conference include the following:

  • Biomaterials;
  • Characterization;
  • Digital transformation;
  • Functional materials, surfaces and devices;
  • Circular materials;
  • Modeling and simulation;
  • Processing and synthesis;
  • Structural materials.

The following MDPI journals will be represented at the conference:

If you are planning to attend the above conference, please feel free to stop by our booth. Our delegates look forward to meeting you in person to answer any questions that you may have. For more information about the conference, please visit the following link.

https://dgm.de/mse/2024/

25–27 October 2024 19th International Conference on Information Security Practice and Experience (ISPEC 2024)

Wuhan, China

The 19th International Conference on Information Security Practice and Experience (ISPEC 2024) will be held between October 25 and 27, 2024, in Wuhan, organized by Wuhan University of Technology and Central China Normal University. The ISPEC conference is an established forum that gathers researchers and practitioners to provide a confluence of new information security technologies, including their applications and integration with IT systems in various vertical sectors. The conference's main goal is to promote research on new information security technologies, including their applications and their integration with IT systems in various vertical sectors. Authors are invited to submit full papers presenting new research results related to information security technologies and applications. The Best Paper and Best Student Paper will be awarded during the conference. Registered and Presented papers will be submitted for inclusion into IEEE Xplore and indexed by EI Compendex.

https://ispec2024.github.io/ISPEC2024/

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