Search Results (2)

Nanocomposites composed of Cu and Mo were investigated by means of molecular dynamics (MD) simulations to study the incoherent interface between Cu and Mo. In order to select an appropriate potential capable of accurately describing the Cu-Mo system, five many-body potentials were compared: three Embedded Atom Method (EAM) potentials, a Tight Binding Second Moment Approximation (TB-SMA) potential, and a Modified Embedded Atom Method (MEAM) potential. Among these, the EAM potential proposed by Zhou in 2001 was determined to provide the best compromise for the current study. The simulated system was constructed with two layers of Cu and Mo forming an incoherent fcc-Cu(111)/bcc-Mo(110) interface, based on the Nishiyama–Wassermann (NW) and Kurdjumov–Sachs (KS) orientation relationships (OR). The interfacial energies were calculated for each orientation relationship. The NW configuration emerged as the most stable, with an interfacial energy of 1.83 J/m², compared to 1.97 J/m² for the KS orientation. Subsequent simulations were dedicated to modeling Cu atomic deposition onto a Mo(110) substrate at 300 K. These simulations resulted in the formation of a dense layer with only a few defects in the two Cu planes closest to the interface. The interfacial structures were characterized by computing selected area electron diffraction (SAED) patterns. A direct comparison of theoretical and numerical SAED patterns confirmed the presence of the NW orientation relationship in the nanocomposites formed during deposition, corroborating the results obtained with the model fcc-Cu(111)/bcc-Mo(110) interfaces. Full article

Nanometric multilayers composed of immiscible Ag and Ni metals were investigated by means of molecular dynamics simulations. The semi-coherent interface between Ag and Ni was examined at low temperatures by analyzing in-plane strain and defect formation. The relaxation of the interface under annealing conditions was also considered. With increasing temperature, a greater number of atomic planes participated in the interface, resulting in enhanced mobility of Ag and Ni atoms, as well as partial dissolution of Ni within the amorphous Ag. To mimic polycrystalline layers with staggered grains, a system with a triple junction between a silver single layer and two grains of nickel was examined. At high temperatures (900 K and 1000 K), the study demonstrated grain boundary grooving. The respective roles of Ni and Ag mobilities in the first steps of grooving dynamics were established. At 1100 K, a temperature close but still below the melting point of Ag, the Ag layer underwent a transition to an amorphous/premelt state, with Ni grains rearranging themselves in contact with the amorphous layer. Full article