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Keywords = fine ETP copper wire

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11 pages, 7487 KiB  
Proceeding Paper
Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods
by Oscar Rodríguez-Alabanda, Esther Molero, Marius Tintelecan, Guillermo Guerrero-Vaca, Pablo E. Romero and Gustavo Aristides Santana Martinez
Proceedings 2020, 63(1), 12; https://doi.org/10.3390/proceedings2020063012 - 11 Dec 2020
Viewed by 2747
Abstract
Electrolytic tough pitch copper is commonly used in electric and electronic applications while fine copper wires are widely used in electronic conductors. A multi-pass wiredrawing process was designed for the manufacturing of fine pure copper wire, from 0.50 mm to 0.10 mm in [...] Read more.
Electrolytic tough pitch copper is commonly used in electric and electronic applications while fine copper wires are widely used in electronic conductors. A multi-pass wiredrawing process was designed for the manufacturing of fine pure copper wire, from 0.50 mm to 0.10 mm in diameter. The analytical model and the finite element analysis (FEA) were performed to validate the pass schedule design. The initial wire was mechanically characterized, and the pass schedule design was stablished by the analytical method according to the specific criteria. The sequence of wiredrawing passes was modeled in the finite element method (FEM) software in order to analyze and validate the designed pass schedule. The combination of these methods allowed designing and validating the wiredrawing pass schedule to implement it in a real process with guaranteed results. This work contributes in showing a combined methodology for the design and virtual validation of the pass schedule in the case of multistage wiredrawing of ETP copper fine wires. Full article
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