The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Si
p/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times.
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The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Si
p/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times. The results showed that the maximum joint shear strength of 96.62 MPa was achieved when the joint was made using Al-7.5Si-23.0Cu-2.0Ni-1.0Ti as the brazing filler metal at 580 °C for 30 min. X-ray diffraction (XRD) analysis of the joint indicated that the main phases were composed of Al, Si and intermetallics, including CuAl, TiFeSi, TiNiSi and Al
3Ti. When the brazing temperature ranged from 570 °C to 590 °C, the leakage rate of joints remained at 10
−8 Pa·m
3/s or better. When the joint was made using Al-7.5Si-23.0Cu-2.0Ni-2.5Ti as the brazing filler metal at 580 °C for 30 min, the higher level of Ti content in the brazing filler metal resulted in the formation of a flake-like Ti(AlSi)
3 intermetallic phase with an average size of 7 µm at the interface between the brazing seam and Si
p/Al MMCs. The joint fracture was generally in the form of quasi-cleavage fracture, which primarily occurred at the interface between the filler metal and the Si
p/Al MMCs. The micro-crack propagated not only Ti(AlSi)
3, but also the Si particles in the substrate.
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