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Editorial

Acknowledgement to Reviewers of High-Throughput in 2017

MDPI AG, St. Alban-Anlage 66, 4052 Basel, Switzerland
High-Throughput 2018, 7(1), 3; https://doi.org/10.3390/ht7010003
Submission received: 16 January 2018 / Revised: 16 January 2018 / Accepted: 16 January 2018 / Published: 16 January 2018
Peer review is an essential part in the publication process, ensuring that High-Throughput maintains high quality standards for its published papers. In 2017, a total of 18 papers were published in the journal. Thanks to the cooperation of our reviewers, the median time to first decision was 23 days and the median time to publication was 50 days. The editors would like to express their sincere gratitude to the following reviewers for their time and dedication in 2017:
Abdulmalik, OsheizaMou, Haiwei
Arany, PraveenNa, Huimin
Ben-Yoav, HadarNuthikattu, Saivageethi
Blomberg, JonasPérez, Soledad
Borres, MagnusPerumal, Deepak
Chen, Chun-LiangPi, Rongbiao
Clifford, GaryPortelius, Erik
Conesa, AnaPurutçuoğlu, Vilda
De Bragança Pereira, Carlos AlbertoRaynal, Florence
Devine, DeirdreRobertson, Douglas
Do, ThuySaikaly, Pascal
Enguita, FranciscoSinghrao, Sim K.
Esguerra, JonathanStafford, Philip
Farlik, MatthiasSumoy, Lauro
Gajula, RajendraTelen, Marilyn
Gilbert, ElizabethTomasetti, Marco
Gowans, EricUrbanelli, Lorena
Hindmarch, CharlieVashist, Sandeep
Huang, Weei-YuarnVladimirov, Vladimir
Ijiri, DaichiVolinia, Stefano
Kodzius, RimantasVoss, Matthias
Lin, Liang-TzungWang, Rongsheng
Liu, ZhixiaWeng, Chingfeng
Lou, FangfeiWu, Hao
Melcher, KarstenXu, Wei
Métayer-Coustard, SoniaYen, Feng-Lin
Miernyk, Jan A

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MDPI and ACS Style

Editorial Office, H.-T. Acknowledgement to Reviewers of High-Throughput in 2017. High-Throughput 2018, 7, 3. https://doi.org/10.3390/ht7010003

AMA Style

Editorial Office H-T. Acknowledgement to Reviewers of High-Throughput in 2017. High-Throughput. 2018; 7(1):3. https://doi.org/10.3390/ht7010003

Chicago/Turabian Style

Editorial Office, High-Throughput. 2018. "Acknowledgement to Reviewers of High-Throughput in 2017" High-Throughput 7, no. 1: 3. https://doi.org/10.3390/ht7010003

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