Next Article in Journal
Neuro-Inspired Spike-Based Motion: From Dynamic Vision Sensor to Robot Motor Open-Loop Control through Spike-VITE
Next Article in Special Issue
Dynamic Characteristics of Micro-Beams Considering the Effect of Flexible Supports
Previous Article in Journal
Two Novel Measurements for the Drive-Mode Resonant Frequency of a Micromachined Vibratory Gyroscope
Previous Article in Special Issue
A Robust Nonlinear Observer for Real-Time Attitude Estimation Using Low-Cost MEMS Inertial Sensors
Sensors 2013, 13(11), 15785-15804; doi:10.3390/s131115785

Design and Implementation of a Micromechanical Silicon Resonant Accelerometer

1,2,*  and 1,2
1 Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing 210096, China 2 School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China
* Author to whom correspondence should be addressed.
Received: 26 August 2013 / Revised: 4 November 2013 / Accepted: 7 November 2013 / Published: 19 November 2013
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2013)


The micromechanical silicon resonant accelerometer has attracted considerable attention in the research and development of high-precision MEMS accelerometers because of its output of quasi-digital signals, high sensitivity, high resolution, wide dynamic range, anti-interference capacity and good stability. Because of the mismatching thermal expansion coefficients of silicon and glass, the micromechanical silicon resonant accelerometer based on the Silicon on Glass (SOG) technique is deeply affected by the temperature during the fabrication, packaging and use processes. The thermal stress caused by temperature changes directly affects the frequency output of the accelerometer. Based on the working principle of the micromechanical resonant accelerometer, a special accelerometer structure that reduces the temperature influence on the accelerometer is designed. The accelerometer can greatly reduce the thermal stress caused by high temperatures in the process of fabrication and packaging. Currently, the closed-loop drive circuit is devised based on a phase-locked loop. The unloaded resonant frequencies of the prototype of the micromechanical silicon resonant accelerometer are approximately 31.4 kHz and 31.5 kHz. The scale factor is 66.24003 Hz/g. The scale factor stability is 14.886 ppm, the scale factor repeatability is 23 ppm, the bias stability is 23 μg, the bias repeatability is 170 μg, and the bias temperature coefficient is 0.0734 Hz/°C.
Keywords: accelerometer; MEMS; resonant; temperature characteristic; structure design; drive circuit accelerometer; MEMS; resonant; temperature characteristic; structure design; drive circuit
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

Supplementary material


Share & Cite This Article

Further Mendeley | CiteULike
Export to BibTeX |
EndNote |
MDPI and ACS Style

Huang, L.; Yang, H.; Gao, Y.; Zhao, L.; Liang, J. Design and Implementation of a Micromechanical Silicon Resonant Accelerometer. Sensors 2013, 13, 15785-15804.

View more citation formats

Related Articles

Article Metrics

For more information on the journal, click here


[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert