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Sensors 2009, 9(8), 6200-6218; doi:10.3390/s90806200

Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists

Micro-System Technology Center, Industrial Technology Research Institute. 709 Tainan, Taiwan
Institute of Electro-Optical Engineering, National Sun Yat-Sen University, 804 Kaohsiung, Taiwan
Author to whom correspondence should be addressed.
Received: 30 June 2009 / Revised: 27 July 2009 / Accepted: 3 August 2009 / Published: 5 August 2009
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering - 2009)
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A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span (TCO) response of -0.19% span/°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of -0.065% span/°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification -0.2% span/°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors. View Full-Text
Keywords: pressure sensor; photoresist; packaging pressure sensor; photoresist; packaging

This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Chen, L.-T.; Chang, J.-S.; Hsu, C.-Y.; Cheng, W.-H. Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists. Sensors 2009, 9, 6200-6218.

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