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Sensors 2010, 10(4), 3989-4001; doi:10.3390/s100403989
Review

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

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Received: 5 January 2010; in revised form: 8 March 2010 / Accepted: 22 March 2010 / Published: 20 April 2010
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Abstract: This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.
Keywords: MEMS; wafer level thin film package; packaging; resonator MEMS; wafer level thin film package; packaging; resonator
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Zaal, J.J.M.; Van Driel, W.D.; Zhang, G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 2010, 10, 3989-4001.

AMA Style

Zaal JJM, Van Driel WD, Zhang G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors. 2010; 10(4):3989-4001.

Chicago/Turabian Style

Zaal, Jeroen J. M.; Van Driel, Willem D.; Zhang, G.Q. 2010. "Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices." Sensors 10, no. 4: 3989-4001.



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