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Sensors 2010, 10(4), 3989-4001; doi:10.3390/s100403989

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands
Author to whom correspondence should be addressed.
Received: 5 January 2010 / Revised: 8 March 2010 / Accepted: 22 March 2010 / Published: 20 April 2010
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering - 2009)
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This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.
Keywords: MEMS; wafer level thin film package; packaging; resonator MEMS; wafer level thin film package; packaging; resonator
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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Zaal, J.J.M.; Van Driel, W.D.; Zhang, G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 2010, 10, 3989-4001.

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