Sensors 2010, 10(4), 3989-4001; doi:10.3390/s100403989
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Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

Jeroen J. M. Zaal* email, Willem D. Van Drielemail and G.Q. Zhangemail
Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands
* Author to whom correspondence should be addressed.
Received: 5 January 2010; in revised form: 8 March 2010 / Accepted: 22 March 2010 / Published: 20 April 2010
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering - 2009)
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Abstract: This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.
Keywords: MEMS; wafer level thin film package; packaging; resonator

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Cite This Article

MDPI and ACS Style

Zaal, J.J.M.; Van Driel, W.D.; Zhang, G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 2010, 10, 3989-4001.

AMA Style

Zaal JJM, Van Driel WD, Zhang G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors. 2010; 10(4):3989-4001.

Chicago/Turabian Style

Zaal, Jeroen J. M.; Van Driel, Willem D.; Zhang, G.Q. 2010. "Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices." Sensors 10, no. 4: 3989-4001.

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