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Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices
Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands
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Received: 5 January 2010; in revised form: 8 March 2010 / Accepted: 22 March 2010 / Published: 20 April 2010
Abstract: This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.
Keywords: MEMS; wafer level thin film package; packaging; resonator
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Cite This Article
MDPI and ACS Style
Zaal, J.J.M.; Van Driel, W.D.; Zhang, G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 2010, 10, 3989-4001.
Zaal JJM, Van Driel WD, Zhang G. Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors. 2010; 10(4):3989-4001.
Zaal, Jeroen J. M.; Van Driel, Willem D.; Zhang, G.Q. 2010. "Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices." Sensors 10, no. 4: 3989-4001.