Special Issue "Selected Papers from ICASI 2015"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (31 August 2015)
Prof. Dr. Artde Donald Kin-Tak Lam
College of Physics and Information Engineering Fuzhou University, Fuzhou, Fujian PR China
The 2015 International Conference on Applied System Innovation (ICASI 2015) will be held in Japan on May 22–26, 2015, and will provide a unified communication platform for researchers in a wide range of topics. Scientists all over the world actively want to discover new advanced materials in electrical and mechanical engineering. In recent years, the application of advanced materials has been a highly developing field, in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. Therefore, the field of electrical and mechanical materials has been a subject of review. The scope of ICASI 2015 not only encompasses material sizes at the nanoscale, but also in various dimensions where the onset of size-dependent phenomena usually enables novel applications.
This Special Issue selects excellent papers from ICASI 2015 and covers a very broad scope, including fundamental and advanced materials of electrical and mechanical engineering, their synthesis, engineering their application properties based on optical, electrochemical, magnetic, acoustic, and thermal transduction, their integration with many elements, designing of electrical or mechanical devices, evaluation various performance and exploring their broad applications in industry, environmental control, material analysis, etc. We invite investigators to contribute original research articles, as well as review articles, to this Special Issue. Potential topics include, but are not limited to:
• Recent developments in fundamental and advanced materials with new electrical and optical properties
• Nanomaterials for preparation and applications
• Computational analysis for materials and structures
• Combinatorial methods for mechanical design and optimization
• Mechanical applications in advanced materials
Prof. Dr. Teen-Hang Meen
Dr. Stephen D. Prior
Prof. Dr. Artde Donald Kin-Tak Lam
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.