Special Issue "Advances in MMICs"

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A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: 28 February 2015

Special Issue Editor

Guest Editor
Dr. Geok Ing Ng
Division of Microelectronics, School of Electrical & Electronic Engineering, College of Engineering, Nanyang Technological University, Singapore 639798
Website: http://www.mi.eee.ntu.edu.sg/AboutUs/directory/Pages/NGGeokIng.aspx
E-Mail: EGING@ntu.edu.sg
Phone: +65-6790-5013
Fax: +65-6793-3318
Interests: compound semiconductor based high frequency devices; gallium nitride on silicon HEMTs; MMIC

Special Issue Information

Dear Colleagues,

Monolithic Microwave Integrated Circuits (MMICs) have come a long way since its first inception in 1968. The effort to develop MMIC technology was originally motivated by the needs to develop miniature size microwave circuits primarily for defense applications. The MIMIC program by Defense Advanced Research Projects Agency (DARPA) was one of the main driving forces to push for the state-of-the-art MMIC technologies. The program was an overwhelming success which gave rise to MMICs that are being deployed in many defense electronic systems. With the success of this breakthrough technology, MMICs were subsequently adopted by commercial foundries worldwide for many of today’s commercial applications.

Since the first realization of MMIC using GaAs MESFET technology, MMIC performance has made tremendous progress with the advancement in material and device technologies. For examples, GaAs-based and InP-based HEMTs and HBTs, and the more recent GaN-based HEMTs. Si-based MMICs, in particular, have also made remarkable advancement over the years with unprecedented high operating frequencies. Besides active devices, passive components and design techniques have also made significant progress, further contributing to the enhancement of device performance, improvement of form factor and cost reduction of modern day MMICs.

This special issue will invite manuscripts on MMIC-related papers in areas including but not limited to active and passive components for MMIC applications, MMIC design, packaging, testing and reliability. The papers may be of original contributions or reviews. We aim for this special issue to refresh our memories on the past development of MMICs, their recent developments and also provide us with a glimpse of the future trend in this technology.

Dr. Geok Ing Ng
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed Open Access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 500 CHF (Swiss Francs). English correction and/or formatting fees of 250 CHF (Swiss Francs) will be charged in certain cases for those articles accepted for publication that require extensive additional formatting and/or English corrections.

Keywords

  • MMIC
  • microwave/millimeter-wave
  • compound semiconductors
  • MESFET; HEMT; HBT
  • transistors; diodes
  • active components; passive components
  • packaging
  • reliability

Published Papers (3 papers)

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Displaying article 1-3
p. 1373-1415
by , ,  and
Micromachines 2014, 5(4), 1373-1415; doi:10.3390/mi5041373
Received: 13 March 2014; in revised form: 15 September 2014 / Accepted: 5 November 2014 / Published: 10 December 2014
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(This article belongs to the Special Issue Advances in MMICs)
p. 711-721
by ,  and
Micromachines 2014, 5(3), 711-721; doi:10.3390/mi5030711
Received: 5 June 2014; in revised form: 9 August 2014 / Accepted: 3 September 2014 / Published: 12 September 2014
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(This article belongs to the Special Issue Advances in MMICs)
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p. 570-582
by , , ,  and
Micromachines 2014, 5(3), 570-582; doi:10.3390/mi5030570
Received: 30 May 2014; in revised form: 21 July 2014 / Accepted: 21 July 2014 / Published: 22 August 2014
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Last update: 13 August 2014

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