Special Issue "Novel Sensors for Non-Destructive Testing and Structural Health Monitoring"

Quicklinks

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: 31 January 2015

Special Issue Editor

Guest Editor
Dr. Thomas Schumacher
Civil and Environmental Engineering, University of Delaware, Newark, DE 19716, USA
Website: http://www.ce.udel.edu/directories/profiles.html?schumact
E-Mail: schumact@udel.edu
Interests: novel sensing methodologies for non-destructive testing (NDT) and structural health monitoring (SHM) of civil infrastructure: Quantitative acoustic emission monitoring, carbon nanotube-based sensing composites, digital video-based monitoring; behavior and durability of concrete structures; sustainable structures; probabilistic approaches

Special Issue Information

Dear Colleagues,

The fields of non-destructive testing (NDT) and structural health monitoring (SHM) have become of great importance to inspect and maintain structures and mechanical systems. Sensors represent the ‘ears’ and ‘eyes’ of NDT and SHM and are thus a crucial element in the measurement process. Over the past few decades, new advanced sensors and sensing methodologies have been developed in laboratories and evaluated in the field. Cross-pollination from other fields such as the geosciences and medicine have introduced new ideas and further propelled advancement of existing sensing methodologies.

In this Special Issue, we solicit review articles, original research papers, and short communications covering novel sensors and sensing methodologies for NDT and SHM of structures (e.g. buildings, bridges, off-shore platforms) and mechanical systems (e.g. aerospace, automobile, power generation). Particularly, we are interested in recent developments with respect to the actual sensing aspect, as opposed to the signal analysis approaches or interpretation of collected data. Sensors and sensing methodologies of interest include, but are not limited to: Novel physical sensors, distributed sensors, optical and other non-contact sensors, and MEMS sensors. A typical submission should explain the properties and physics of the sensor, describe the physical entity inferred from the measurement, discuss the applications and limitations using laboratory or field data, and deliberate the level of readiness for application, including state of standard and code development (if applicable).

Please don’t hesitate to contact me should you be uncertain whether your work falls within the general scope of this Special Issue. I look forward to your contribution!

Dr. Thomas Schumacher
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed Open Access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs).


Published Papers (5 papers)

Download All Papers
Sort by:
Display options:
Select articles Export citation of selected articles as:
Select/unselect all
Displaying article 1-5
p. 19493-19506
by ,  and
Sensors 2014, 14(10), 19493-19506; doi:10.3390/s141019493
Received: 5 August 2014; in revised form: 24 September 2014 / Accepted: 25 September 2014 / Published: 17 October 2014
Show/Hide Abstract | PDF Full-text (802 KB)
p. 14210-14221
by , , , ,  and
Sensors 2014, 14(8), 14210-14221; doi:10.3390/s140814210
Received: 23 May 2014; in revised form: 21 July 2014 / Accepted: 25 July 2014 / Published: 4 August 2014
Show/Hide Abstract | PDF Full-text (990 KB) | HTML Full-text | XML Full-text
p. 13134-13148
by , , ,  and
Sensors 2014, 14(7), 13134-13148; doi:10.3390/s140713134
Received: 29 April 2014; in revised form: 18 June 2014 / Accepted: 3 July 2014 / Published: 21 July 2014
Show/Hide Abstract | PDF Full-text (1219 KB) | HTML Full-text | XML Full-text
p. 12803-12815
by , ,  and
Sensors 2014, 14(7), 12803-12815; doi:10.3390/s140712803
Received: 1 May 2014; in revised form: 5 July 2014 / Accepted: 14 July 2014 / Published: 18 July 2014
Show/Hide Abstract | PDF Full-text (5752 KB) | HTML Full-text | XML Full-text
p. 12568-12584
by , ,  and
Sensors 2014, 14(7), 12568-12584; doi:10.3390/s140712568
Received: 4 April 2014; in revised form: 4 July 2014 / Accepted: 7 July 2014 / Published: 14 July 2014
Show/Hide Abstract | PDF Full-text (1869 KB) | HTML Full-text | XML Full-text
Select/unselect all
Displaying article 1-5
Select articles Export citation of selected articles as:

Last update: 24 April 2014

Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert