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Micromachines
Special Issues
GaN Heterostructure Devices: From Materials to Application
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GaN Heterostructure Devices: From Materials to Application

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".

Deadline for manuscript submissions: 30 July 2024 | Viewed by 1472

Special Issue Editor

Prof. Dr. Baijun Zhang

E-Mail Website
Guest Editor
State Key Laboratory of Optoelectronic Materials and Technology, Sun Yat-sen University, Guangzhou 510006, China
Interests: electronic device; biosensor; THz device

Special Issue Information

Dear Colleagues,

Gallium nitride and its related compound semiconductor materials (AlN, AlGaN, InGaN, InN) and heterostructures (AlGaN/GaN, InGaN/GaN, AlInGaN/GaN, etc.) are attractive wide-band semiconductor materials due to their unique characteristics. Their successful applications in solid-state lighting, power electronic devices, RF devices, UV-LED, Micro-LED, and ultraviolet photodetectors have promoted the rapid development of gallium nitride-based materials and devices. Gallium nitride-based materials also show great application potential in some interdisciplinary fields. In recent years, their application in the fields of biomedicine and brain neuroscience have been widely considered by researchers, due to their chemical stability and biological compatibility. This Special Issue will publish research papers and review articles focusing on recent advances in gallium nitride-based materials and devices, including novel applied research within the crossover sciences.

Prof. Dr. Baijun Zhang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • GaN
  • heterostructure
  • optoelectronic device
  • electronic device
  • biosensor
  • THz device

Published Papers (2 papers)

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Research

9 pages, 3840 KiB  
Communication
Effect of GaN Cap Thickness on the DC Performance of AlGaN/GaN HEMTs
by Zuorong Nie, Kai Wang, Xiaoyi Liu and Hong Wang
Micromachines 2024, 15(5), 571; https://doi.org/10.3390/mi15050571 - 26 Apr 2024
Viewed by 316
Abstract
We prepared AlGaN/GaN high electron mobility transistors (HEMTs) with GaN cap thicknesses of 0, 1, 3, and 5 nm and compared the material characteristics and device performances. It was found that the surface morphology of the epitaxial layer was effectively improved after the [...] Read more.
We prepared AlGaN/GaN high electron mobility transistors (HEMTs) with GaN cap thicknesses of 0, 1, 3, and 5 nm and compared the material characteristics and device performances. It was found that the surface morphology of the epitaxial layer was effectively improved after the introduction of the GaN cap layer. With the increase of the GaN cap thickness, the carrier concentration (ns) decreased and the carrier mobility (μH) increased. Although the drain saturation current (IdSat) of the device decreased with the increasing GaN cap thickness, the excessively thin GaN layer was not suitable for the cap layer. The thicker GaN layer not only improved the surface topography of the epitaxial layer but also effectively improved the off-state characteristics of the device. The optimal cap thickness was determined to be 3 nm. With the introduction of the 3 nm GaN cap, the IdSat was not significantly reduced. However, both the off-state gate leakage current (IgLeak) and the off-state leakage current (IdLeak) decreased by about two orders of magnitude, and the breakdown voltage (BV) increased by about 70 V. Full article
(This article belongs to the Special Issue GaN Heterostructure Devices: From Materials to Application)
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13 pages, 9907 KiB  
Article
Material Design of Ultra-Thin InN/GaN Superlattices for a Long-Wavelength Light Emission
by Leilei Xiang, Enming Zhang, Wenyu Kang, Wei Lin and Junyong Kang
Micromachines 2024, 15(3), 361; https://doi.org/10.3390/mi15030361 - 01 Mar 2024
Viewed by 845
Abstract
GaN heterostructure is a promising material for next-generation optoelectronic devices, and Indium gallium nitride (InGaN) has been widely used in ultraviolet and blue light emission. However, its applied potential for longer wavelengths still requires exploration. In this work, the ultra-thin InN/GaN superlattices (SL) [...] Read more.
GaN heterostructure is a promising material for next-generation optoelectronic devices, and Indium gallium nitride (InGaN) has been widely used in ultraviolet and blue light emission. However, its applied potential for longer wavelengths still requires exploration. In this work, the ultra-thin InN/GaN superlattices (SL) were designed for long-wavelength light emission and investigated by first-principles simulations. The crystallographic and electronic properties of SL were comprehensively studied, especially the strain state of InN well layers in SL. Different strain states of InN layers were applied to modulate the bandgap of the SL, and the designed InN/GaN heterostructure could theoretically achieve photon emission of at least 650 nm. Additionally, we found the SL had different quantum confinement effects on electrons and holes, but an efficient capture of electron-hole pairs could be realized. Meanwhile, external forces were also considered. The orbital compositions of the valence band maximum (VBM) were changed with the increase in tensile stress. The transverse electric (TE) mode was found to play a leading role in light emission in normal working conditions, and it was advantageous for light extraction. The capacity of ultra-thin InN/GaN SL on long-wavelength light emission was theoretically investigated. Full article
(This article belongs to the Special Issue GaN Heterostructure Devices: From Materials to Application)
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