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Micromachines
Special Issues
Advanced MEMS/NEMS Technology, Volume III
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Advanced MEMS/NEMS Technology, Volume III

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (31 March 2021) | Viewed by 5978

Special Issue Editors

Prof. Jin-Woo Kim

E-Mail Website
Guest Editor
Faculty of Biological Engineering and Institute for Nanoscience & Engineering, University of Arkansas, Fayetteville, AR 72701, USA
Interests: hybrid soft materials; nanotheranostics; bio-hybrid micro/nano devices
Dr. John Yeow

E-Mail Website
Guest Editor
Waterloo Institute for Nanotechnology, University of Waterloo, Waterloo, ON N2L 3G1, Canada
Interests: ultrasound; biomedical devices; optical MEMS
Prof. Da-Jeng Yao

E-Mail Website
Guest Editor
Associate Vice President for General AffairsDepartment of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan
Interests: digital microfluidics; intelligent gas sensing system; in vitro fertilization on a chip; and tera hertz system and its applications
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This special issue will publish extended conference proceedings from IEEE-NEMS 2020 (https://ieee-nems.org/2020/) and IEEE-MEMS 2021 (https://www.mems21.org/). Conference external contributions are also welcome.

Micromachines is the leading journal in the MEMS and NEMS fields from MDPI. We want to consolidate original research papers and comprehensive review articles in this Special Issue. We publish manuscripts on the following topics but not limited to:

  • Micro/nanomachines;
  • Optical MEMS and nanophotonics;
  • RF MEMS, resonators and oscillators;
  • Ultrasound MEMS (pMUT and cMUT);
  • Energy harvesting technology;
  • BioMEMS and biomedical devices;
  • Neuroprosthetics and implanted devices;
  • Micro/nanofluidics;
  • Soft materials and robotics;
  • Chemical sensors/gas sensors/sensors for environmental monitoring;
  • Sensor networks/IoT.

Prof. Jin-Woo Kim
Prof. John Yeow
Prof. Da-Jeng Yao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (2 papers)

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Research

14 pages, 6641 KiB  
Article
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
by Seyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi and Alberto Corigliano
Micromachines 2021, 12(4), 361; https://doi.org/10.3390/mi12040361 - 26 Mar 2021
Cited by 8 | Viewed by 2749
Abstract
A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, [...] Read more.
A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3) fabricated wafers with the proposed geometrical feature demonstrated an improvement for the (4) warpage with respect to the plain wafers. A benefit for curvature variation and overall shape of the (5) bonded wafers was also observed. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume III)
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11 pages, 2791 KiB  
Article
Utilization of a Gas-Sensing System to Discriminate Smell and to Monitor Fermentation during the Manufacture of Oolong Tea Leaves
by Ting-Shiang Tseng, Mei-Hui Hsiao, Po-An Chen, Shu-Yen Lin, Shih-Wen Chiu and Da-Jeng Yao
Micromachines 2021, 12(1), 93; https://doi.org/10.3390/mi12010093 - 17 Jan 2021
Cited by 8 | Viewed by 2447
Abstract
The operational duration of shaking tea leaves is a critical factor in the manufacture of oolong tea; this duration influences the formation of its flavor and fragrance. The current method to control the duration of fermentation relies on the olfactory sense of tea [...] Read more.
The operational duration of shaking tea leaves is a critical factor in the manufacture of oolong tea; this duration influences the formation of its flavor and fragrance. The current method to control the duration of fermentation relies on the olfactory sense of tea masters; they monitor the entire process through their olfactory sense, and their experience decides the duration of shaking and setting. Because of this human factor and olfactory fatigue, it is difficult to define an optimum duration of shaking and setting; an inappropriate duration of shaking and setting deteriorates the quality of the tea. In this study, we used metal-oxide-semiconductor gas sensors to establish an electronic nose (E-nose) system and tested its feasibility. This research was divided into two experiments: distinguishing samples at various stages and an on-line experiment. The samples of tea leaves at various stages exhibited large differences in the level of grassy smell. From the experience of practitioners and from previous research, the samples could be categorized into three groups: before the first shaking (BS1), before the shaking group, and after the shaking group. We input the experimental results into a linear discriminant analysis to decrease the dimensions and to classify the samples into various groups. The results show that the smell can also be categorized into three groups. After distinguishing the samples with large differences, we conducted an on-line experiment in a tea factory and tried to monitor the smell variation during the manufacturing process. The results from the E-nose were similar to those of the sense of practitioners, which means that an E-nose has the possibility to replace the sensory function of practitioners in the future. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume III)
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