Special Issue "Diffusion Bonding and Brazing of Advanced Materials"

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: 30 September 2018

Special Issue Editor

Guest Editor
Prof. Sónia Simões

Department of Metallurgical and Materials Engineering, University of Porto, Rua Dr Roberto Frias, 4200-465 Porto, Portugal
Website | E-Mail
Interests: nanomaterials; reactive multilayers; joining (diffusion bonding and brazing); microstructural and mechanical characterizations; titanium alloys; lightweight alloys; titanium and nickel aluminides; metal matrix nanocomposites; phase transformations

Special Issue Information

Dear Colleagues,

Advanced materials generally require the development of novel joining techniques, as this is crucial to integrate them into functional structures and to widen their application field. Additionally, joining constitutes a technology, which influences all the industrial sectors, playing a key role in the economic and social development of a country.

Diffusion bonding and brazing are two straightforward techniques for producing sound and reliable joints since these processes are capable of joining a wide range of materials of interest in the aerospace industry, as well as in many other industrial applications, offering remarkable advantages over conventional fusion welding processes.

Production of dissimilar joints is also crucial for application of these materials. For instance, the combination of advanced ceramic with lightweight alloys, such as titanium or aluminium alloys, is quite attractive, combining the extraordinary properties of the two materials and extending the potential applications particularly into components for the automotive and aerospace industries. The major challenge in the production of these joints is to overcome the enormous differences in mechanical behaviour, as well as thermal expansion coefficients and so new approaches need to be developed to produce dissimilar joints successfully.

This Special Issue aims at showcasing the recent progresses in the joining technologies of advanced materials, with a particular attention for the microstructure–mechanical properties relationships of the bonded joints. Both theoretical and experimental research, review articles, and novel results are welcome.

Prof. Sónia Simões
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Advanced materials
  • Metals, Ceramics and Composites
  • Diffusion Bonding
  • Brazing
  • Micro and nanojoining
  • Dissimilar joints
  • Microstrutural characterization
  • Mechanical properties
  • New approaches to joining technologies
  • Modelling and simulation

Published Papers (2 papers)

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Research

Open AccessArticle Transient Liquid Phase Bonding of Magnesium Alloy AZ31 Using Cu Coatings and Cu Coatings with Sn Interlayers
Metals 2018, 8(1), 60; doi:10.3390/met8010060
Received: 28 November 2017 / Revised: 27 December 2017 / Accepted: 11 January 2018 / Published: 16 January 2018
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Abstract
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu coatings with Sn interlayer. Copper coatings were used for one set of the bonds, and a combination of Cu coatings and Sn interlayer was used for the
[...] Read more.
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu coatings with Sn interlayer. Copper coatings were used for one set of the bonds, and a combination of Cu coatings and Sn interlayer was used for the other set of bonds. The bonding temperature was fixed at 520 °C, and various bonding times were applied. This study shows that the bonds produced using only Cu coatings have shown weaker bonds compared to the bonds made using Cu coatings and Sn interlayer. The Cu2Mg particles were detected at the joint region of both bonds made by Cu coatings and Cu coatings with Sn interlayer by X-ray diffraction (XRD). However, it has been observed that the joint region was dominated by solid solution which is rich in Mg. Sn interlayer was not contributed to the intermetallic compound (IMC) at the joint region, and therefore it was diffused away through the Mg matrix. Within the joint interface, a slight increase of micro-hardness was observed compared to Mg base metal alloy. This was attributed to the formation and presence of IMC’s within the joint region. It was noticed that the presence of the Sn interlayer improved the joint strength by reducing the pores at the joint region. Pores were clearly observed for those bonds made using Cu coatings—especially for region where the fracture occurs; this was accomplished by scanning electron microscope (SEM). Full article
(This article belongs to the Special Issue Diffusion Bonding and Brazing of Advanced Materials)
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Figure 1

Open AccessArticle Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE–Si–Al–O–N (RE = Y or Yb) Glasses
Metals 2017, 7(11), 500; doi:10.3390/met7110500
Received: 15 October 2017 / Revised: 6 November 2017 / Accepted: 9 November 2017 / Published: 13 November 2017
PDF Full-text (13209 KB) | HTML Full-text | XML Full-text
Abstract
The joining of porous Si3N4 to dense Si3N4 ceramics has been successfully performed using mixed RE2O3 (RE = Y or Yb), Al2O3, SiO2, and α-Si3N4
[...] Read more.
The joining of porous Si3N4 to dense Si3N4 ceramics has been successfully performed using mixed RE2O3 (RE = Y or Yb), Al2O3, SiO2, and α-Si3N4 powders. The results suggested that the α-Si3N4 powders partly transformed into β-SiAlON and partly dissolved into oxide glass to form oxynitride glass. Thus, composites of glass/β-SiAlON-ceramic formed in the seam of joints. Due to the capillary action of the porous Si3N4 ceramic, the molten glass solder infiltrated into the porous Si3N4 ceramic side during the joining process and formed the “infiltration zone” with a thickness of about 400 μm, which contributed to the heterogeneous distribution of the RE–Si–Al–O–N glasses in the porous Si3N4 substrate. In-situ formation of β-SiAlON in the seam resulted in a high bonding strength. The maximum bending strength of 103 MPa and 88 MPa was reached for the porous Si3N4/dense Si3N4 joints using Y–Si–Al–O–N and Yb–Si–Al–O–N glass solders, respectively. Full article
(This article belongs to the Special Issue Diffusion Bonding and Brazing of Advanced Materials)
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