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Metals 2017, 7(11), 500; doi:10.3390/met7110500

Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE–Si–Al–O–N (RE = Y or Yb) Glasses

School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
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Received: 15 October 2017 / Revised: 6 November 2017 / Accepted: 9 November 2017 / Published: 13 November 2017
(This article belongs to the Special Issue Diffusion Bonding and Brazing of Advanced Materials)
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Abstract

The joining of porous Si3N4 to dense Si3N4 ceramics has been successfully performed using mixed RE2O3 (RE = Y or Yb), Al2O3, SiO2, and α-Si3N4 powders. The results suggested that the α-Si3N4 powders partly transformed into β-SiAlON and partly dissolved into oxide glass to form oxynitride glass. Thus, composites of glass/β-SiAlON-ceramic formed in the seam of joints. Due to the capillary action of the porous Si3N4 ceramic, the molten glass solder infiltrated into the porous Si3N4 ceramic side during the joining process and formed the “infiltration zone” with a thickness of about 400 μm, which contributed to the heterogeneous distribution of the RE–Si–Al–O–N glasses in the porous Si3N4 substrate. In-situ formation of β-SiAlON in the seam resulted in a high bonding strength. The maximum bending strength of 103 MPa and 88 MPa was reached for the porous Si3N4/dense Si3N4 joints using Y–Si–Al–O–N and Yb–Si–Al–O–N glass solders, respectively. View Full-Text
Keywords: silicon nitride; glass solder; β-SiAlON; joining; infiltration silicon nitride; glass solder; β-SiAlON; joining; infiltration
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Li, L.; Sun, L.; Liu, C.; Wang, X.; Wang, X.; Zhang, J. Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE–Si–Al–O–N (RE = Y or Yb) Glasses. Metals 2017, 7, 500.

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