Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
5.2
3.0
Journals
Micromachines
Special Issues
Advances in Micromechanics and Microengineering
share announcement

Advances in Micromechanics and Microengineering

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (15 January 2011) | Viewed by 19569

Special Issue Editors

Prof. Dr. Craig R. Friedrich

E-Mail Website
Guest Editor
Department of Mechanical Engineering - Engineering Mechanics, 815 RL Smith, Michigan Technological University, Hougjhton, MI 49931, USA
Interests: micromechanical machining; precision machining; micromechanical processes; microsystems; bioinspired sensing; bio-nano-hybrid materials; nanofabrication
Prof. Dr. Igor Tsukrov

E-Mail Website
Guest Editor
Department of Mechanical Engineering, University of New Hampshire, Durham, NH 03824, USA
Interests: micromechanics and fracture of composite materials; computational solid mechanics; finite element method; ocean engineering

Special Issue Information

Dear Colleagues,

As machines continue to be made smaller, there is the requirement for better understanding and control of the materials from which the micromachines are fabricated and the mechanics by which those materials perform. In addition, the engineering of these machines must account for many factors not normally considered in the macro world including size scaling effects on the structural and dynamic characteristics, nonhomogenity and anisotropy of the constituent materials, thermal issues where surface effects can become dominant over bulk effects, the ability to power and control micromachines, and the fundamental and applied mechanics which are basic to the successful evolution of micromachine designs. The special issue on Advances in Micromechanics and Microengineering is expected to bring the latest research results in microscale mechanics and engineering related to the realization of micromachines in the broadest sense.

Prof. Dr. Craig R. Friedrich
Prof. Dr. Igor Tsukrov
Guest Editors

Keywords

  • micromechanics
  • micromachines
  • micromachining
  • microdynamics
  • micromaterial
  • scaling effects
  • microthermal
  • precision control

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (2 papers)

Download All Papers
Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

1167 KiB  
Article
Mori-Tanaka Based Estimates of Effective Thermal Conductivity of Various Engineering Materials
by Jan Stránský, Jan Vorel, Jan Zeman and Michal Šejnoha
Micromachines 2011, 2(2), 129-149; https://doi.org/10.3390/mi2020129 - 15 Apr 2011
Cited by 47 | Viewed by 10324 | Correction
Abstract
The purpose of this paper is to present a simple micromechanics-based model to estimate the effective thermal conductivity of macroscopically isotropic materials of matrix-inclusion type. The methodology is based on the well-established Mori-Tanaka method for composite media reinforced with ellipsoidal inclusions, extended to [...] Read more.
The purpose of this paper is to present a simple micromechanics-based model to estimate the effective thermal conductivity of macroscopically isotropic materials of matrix-inclusion type. The methodology is based on the well-established Mori-Tanaka method for composite media reinforced with ellipsoidal inclusions, extended to account for imperfect thermal contact at the matrix-inclusion interface, random orientation of particles and particle size distribution. Using simple ensemble averaging arguments, we show that the Mori-Tanaka relations are still applicable for these complex systems, provided that the inclusion conductivity is appropriately modified. Such conclusion is supported by the verification of the model against a detailed finite-element study as well as its validation against experimental data for a wide range of engineering material systems. Full article
(This article belongs to the Special Issue Advances in Micromechanics and Microengineering)
►▼ Show Figures

390 KiB  
Article
Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping
by Chengzhang Li and Michele H. Miller
Micromachines 2010, 1(3), 112-128; https://doi.org/10.3390/microm1010112 - 14 Dec 2010
Cited by 9 | Viewed by 7235
Abstract
This paper investigates the design optimization of an electrostatically actuated microcantilever resonator that operates in air. The nonlinear effects of electrostatic actuation and air damping make the structural dynamics modeling more complex. There is a need for an efficient way to simulate the [...] Read more.
This paper investigates the design optimization of an electrostatically actuated microcantilever resonator that operates in air. The nonlinear effects of electrostatic actuation and air damping make the structural dynamics modeling more complex. There is a need for an efficient way to simulate the system behavior so that the design can be more readily optimized. This paper describes an efficient analytical approach for determining the optimum design for a microcantilever resonant mass sensor. One simple case is described. The sensor design is a square plate that is coated with a functional polymer and attached to the substrate with folded leg springs. The plate has a square hole in the middle to reduce the effect of squeeze film damping. With the analytical approach, the optimum hole size for maximum sensitivity is found. Full article
(This article belongs to the Special Issue Advances in Micromechanics and Microengineering)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-2
Back to TopTop