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Micromachines 2010, 1(3), 112-128; doi:10.3390/microm1010112
Article

Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping

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Received: 27 October 2010; in revised form: 17 November 2010 / Accepted: 6 December 2010 / Published: 14 December 2010
(This article belongs to the Special Issue Advances in Micromechanics and Microengineering)
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Abstract: This paper investigates the design optimization of an electrostatically actuated microcantilever resonator that operates in air. The nonlinear effects of electrostatic actuation and air damping make the structural dynamics modeling more complex. There is a need for an efficient way to simulate the system behavior so that the design can be more readily optimized. This paper describes an efficient analytical approach for determining the optimum design for a microcantilever resonant mass sensor. One simple case is described. The sensor design is a square plate that is coated with a functional polymer and attached to the substrate with folded leg springs. The plate has a square hole in the middle to reduce the effect of squeeze film damping. With the analytical approach, the optimum hole size for maximum sensitivity is found.
Keywords: squeeze film damping; MEMS; resonant mass sensor; optimization squeeze film damping; MEMS; resonant mass sensor; optimization
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Li, C.; Miller, M.H. Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping. Micromachines 2010, 1, 112-128.

AMA Style

Li C, Miller MH. Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping. Micromachines. 2010; 1(3):112-128.

Chicago/Turabian Style

Li, Chengzhang; Miller, Michele H. 2010. "Optimization Strategy for Resonant Mass Sensor Design in the Presence of Squeeze Film Damping." Micromachines 1, no. 3: 112-128.


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