Novel Power Amplifiers and Integrated Circuits: Design and Applications

Dear Colleagues,

With the rapid development of wireless communication, faster transmission rates have led to increasingly complex signals being transmitted, with ultra-high operating frequencies, ultra-large bandwidths, and high peak-to-average ratios. This poses significant challenges to the design of RF front-end circuits, especially power amplifiers. In order to support advanced modulation signals, RF power amplifiers urgently require characteristics that facilitate excellent performance, such as high frequency, high linearity, large bandwidth, high efficiency, and large power backoff range, which may depend on the exploration of new theories, methods, and architectures of power amplifiers. With the widespread development of wireless communication applications, RF power amplifier chips with high integration and miniaturization levels have become a highly promising direction for industrialization, such as radar, satellite links, smart healthcare, and the Internet of Things. Requirements for power amplifier performance, such as reliability, are also crucial in practical application scenarios. Therefore, this Special Issue welcomes innovative research on advanced power amplifiers and related integrated chips, while also focusing on the application of power amplifiers in practical scenarios.

Prof. Dr. Zhiqun Cheng
Dr. Zhiwei Zhang
Guest Editors

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• wireless communication
• advanced RF power amplifiers and chips
• applications of power amplifier chips