Special Issue "Electrochemical Deposition"
A special issue of Metals (ISSN 2075-4701).
Deadline for manuscript submissions: 31 December 2018
Electrochemical deposition is a versatile, efficient, yet simple technique that enables the formation of films, micro- or nano-structures in electrolytic solutions by reduction of metal ions onto a suitable substrate. Metals, alloys, semiconductors, polymers and composites could be obtained, and their structure, morphology as well as functionality could be tailored via the process parameters and the electrolyte chemistry. While industrial processes mostly utilize aqueous electrolytes, researchers and practitioners now have the opportunity to utilize a range of solvents that overcome many of the limitations of aqueous ones, allowing for the electrochemical synthesis of refractory metals as well as a wider range of semiconductor and novel functional materials.
Electrodeposition can be performed under atmospheric conditions and at low temperatures, facilitating integration in electronic manufacturing as well as nanoscale materials and devices for applications in energy conversion and biomedicine among others. In-situ studies of electrodeposition mechanisms have achieved a high level of sophistication and, together with atomistic modeling, can further elucidate and integrate the understanding of fundamental steps in electrodeposition, enabling in turn ever better predictive capabilities and innovations in the field.
This Special Issue seeks to provide a selection of original research, reviews and commentaries focusing on the current trends in electrodeposition and the future of this technology.
A Special Issue, titled “Electrochemical Deposition”, is expected to be prepared and edited in 2018. As a Guest Editor of this Special Issue, I invite you to submit a paper, which will be peer reviewed to be accepted for publication in Metals. The manuscripts are expected by the spring of 2018, with a deadline towards the end of 2018.
Prof. Dr. Giovanni Zangari
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Electrochemical deposition
- Films, alloys, electrolytes, functional materials