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Metals
Special Issues
Brazing and Soldering of Metals and Alloys
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Brazing and Soldering of Metals and Alloys

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Welding and Joining".

Deadline for manuscript submissions: closed (29 February 2024) | Viewed by 2846

Special Issue Editors

Dr. Sabuj Mallik

E-Mail Website
Guest Editor
School of Computing and Engineering, College of Science & Engineering, University of Derby, Markeaton Street, Derby DE22 3AW, UK
Interests: interconnection technologies; thermo-mechanical reliability; finite element modelling; sustainable materials and manufacturing
Dr. Yang Liu

E-Mail Website
Guest Editor
College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China
Interests: soldering; packaging; sintering bonding
Dr. Wenchao Yang

E-Mail Website
Guest Editor
School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China
Interests: metal material design; calculation and characterization

Special Issue Information

Dear Colleagues,

With the development of advanced semiconductor technology, high-power devices and high-density integrated technology have become a popular research focus. The interconnections and bonding within electrical devices are critical for electrical, mechanical and thermal integrity and ultimately impact on the performance and reliability of these devices. This Special Issue focuses on the latest progress in materials, processes and reliability for the metal interconnections. The topics include (but are not limited to) high-power devices, 3D packaging, microsystems, MEMS, and other related fields. The interconnection techniques involved include soldering, brazing, wire-bonding, sometimes sintering, etc. Both experimental and simulation research progress-related articles are welcome for submission to this Special Issue.

Dr. Sabuj Mallik
Dr. Yang Liu
Dr. Wenchao Yang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microsystem
  • packaging
  • MEMS
  • TSV
  • soldering
  • microstructure
  • electromigration
  • reliability
  • enhancement

Published Papers (2 papers)

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Research

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13 pages, 9286 KiB  
Article
Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties
by Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang and Weiming Chen
Metals 2023, 13(8), 1475; https://doi.org/10.3390/met13081475 - 16 Aug 2023
Cited by 2 | Viewed by 1106
Abstract
Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the [...] Read more.
Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the interfacial intermetallic compound (IMC) and mechanical properties of Sn58Bi/Cu solder joints were studied for different Joule heating properties. The results showed that as the cross-sectional area of the Sn58Bi/Cu solder joints increased, the Joule heating of the joint increased. The anode IMC thickness of the joint thickened and transformed into a planar shape. The Bi migrated to the anode region to form a Bi-rich layer and gradually increased in thickness. The cathode IMC thickness first increased, then decreased, and gradually dissolved. The Sn-rich layer formed near the solder side and gradually increased in thickness, with microcracks occurring when the cross-sectional area of the joint increased to 0.75 mm2. The joint shear fracture path moved from the soldering zone near the cathode IMC layer to the interfacial IMC layer. The fracture mechanism of the joint changed from a mixed brittle/tough fracture, dominated by deconstruction and secondary cracking, to a brittle fracture dominated by deconstruction. The joint shear strength was reduced by 60.9% compared to that in the absence of electromigration. Full article
(This article belongs to the Special Issue Brazing and Soldering of Metals and Alloys)
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Review

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23 pages, 6335 KiB  
Review
A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder
by Yilin Li, Shuyuan Yu, Liangwei Li, Shijie Song, Weiou Qin, Da Qi, Wenchao Yang and Yongzhong Zhan
Metals 2023, 13(7), 1209; https://doi.org/10.3390/met13071209 - 29 Jun 2023
Cited by 3 | Viewed by 1346
Abstract
In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified [...] Read more.
In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future. Full article
(This article belongs to the Special Issue Brazing and Soldering of Metals and Alloys)
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