Cu
6Sn
5-
xAg alloys (
x = 0, 3, 6; %, mass fraction) were synthesized using Ag as a dopant through a high-temperature melting technique. The microstructure of the alloy was analyzed using X-ray diffraction (XRD), scanning electron microscopy
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Cu
6Sn
5-
xAg alloys (
x = 0, 3, 6; %, mass fraction) were synthesized using Ag as a dopant through a high-temperature melting technique. The microstructure of the alloy was analyzed using X-ray diffraction (XRD), scanning electron microscopy (SEM), and other equipment, while the hardness of the alloy was measured to investigate the impact of Ag addition on the structure and microstructure of the Cu
6Sn
5 intermetallic compound. This study explored the influence of varying Ag contents on the properties of Cu
6Sn
5 intermetallic compounds, with calculations based on first principles revealing the mechanical properties and density of states of η′-Cu
6Sn
5 and its Ag-doped systems. The results indicated that Cu
6Sn
5-
xAg alloys predominantly existed in three distinct forms, all exhibiting large masses without any impurities or precipitates. First-principle calculations demonstrated that Ag substitution in certain sites suppressed the anisotropy of the Young’s modulus of Cu
6Sn
5, particularly in the Cu1, Cu3, Sn1, and Sn3 positions, while the effect was less significant at the Cu2, Cu4, and Sn2 sites. The introduction of Ag through doping enhanced the covalent bonding within the η′-Cu
6Sn
5 structure, promoting the formation of a stable (Cu, Ag)
6Sn
5 structure.
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