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Special Issue "Materials for Nano/Microelectronic Packaging Applications"

A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: 28 February 2018

Special Issue Editor

Guest Editor
Prof. Dr. Mustafa Yavuz

Mechanical and Mechatronics Engineering Department, University of Waterloo, Waterloo, ON N2L 3G1, Canada
Website | E-Mail
Fax: +1 519 885 5862
Interests: Quantum Electronic Solids, Nano and MEMS Sensors/Actuators/Energy Harvesters, Nano/Micro-joining, Electronic Packaging and Interconnectors

Special Issue Information

Dear Colleagues,

Nano and Micro-Electro-Mechanical Systems (N/MEMS) devices applies to all types of miniaturized devices that are fabricated from silicon- and polymer-based materials using techniques derived from the nano/microelectronics industry. These techniques include isotropic and anisotropic etching, various thin film deposition methods, bonding, masking, and doping techniques employed in integrated circuit (IC) manufacturing.

Integration, packaging and full system feedback of N/MEMS devices are current bottlenecks. For example, the detailed function of a N/MEMS chip is critical to the design of the package, and cost effective packaging and robust reliability are two critical factors for successful commercialization of a N/MEMS device.

This Special Issue aims to introduce contemporary and new generation materials for “Nano/Microelectronic Packaging Applications. Topics include, but are not limited, to:

-Quantum electronic materials as interconnectors in nano/microelectronic industry
-2D (two-dimensional) and transition metal dichalcogenides (TMD) for electronic packaging
-Testing methods and reliability of electronic packaging materials
-Electronic interconnection in biological systems devices (e.g.) biosensors
-Materials for optoelectronic and electro-magnetic devices packaging
-Materials for high-density electronic packaging and interconnection
-Structure–property relations of materials in electronic packing and interconnections
-New materials for electronic packaging
-Computational studies for selecting materials for electronic packing

Prof. Mustafa Yavuz
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Quantum electronic solids
  • Electronic packaging materials
  • Integration, packaging and full system feedback of N/MEMS devices
  • Optoelectronic and electro-magnetic packaging
  • High-density electronic packaging and interconnection
  • Structure–property relations of materials in electronic packing
  • Testing methods and reliability of electronic packaging materials
  • 2D and TMD materials for electronic packaging
  • Nano- and Micro-joining

Published Papers (1 paper)

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Review

Open AccessReview The Property, Preparation and Application of Topological Insulators: A Review
Materials 2017, 10(7), 814; doi:10.3390/ma10070814
Received: 22 June 2017 / Revised: 9 July 2017 / Accepted: 10 July 2017 / Published: 17 July 2017
PDF Full-text (9378 KB) | HTML Full-text | XML Full-text
Abstract
Topological insulator (TI), a promising quantum and semiconductor material, has gapless surface state and narrow bulk band gap. Firstly, the properties, classifications and compounds of TI are introduced. Secondly, the preparation and doping of TI are assessed. Some results are listed. (1) Although
[...] Read more.
Topological insulator (TI), a promising quantum and semiconductor material, has gapless surface state and narrow bulk band gap. Firstly, the properties, classifications and compounds of TI are introduced. Secondly, the preparation and doping of TI are assessed. Some results are listed. (1) Although various preparation methods are used to improve the crystal quality of the TI, it cannot reach the industrialization. Fermi level regulation still faces challenges; (2) The carrier type and lattice of TI are affected by non-magnetic impurities. The most promising property is the superconductivity at low temperature; (3) Magnetic impurities can destroy the time-reversal symmetry of the TI surface, which opens the band gap on the TI surface resulting in some novel physical effects such as quantum anomalous Hall effect (QAHE). Thirdly, this paper summarizes various applications of TI including photodetector, magnetic device, field-effect transistor (FET), laser, and so on. Furthermore, many of their parameters are compared based on TI and some common materials. It is found that TI-based devices exhibit excellent performance, but some parameters such as signal to noise ratio (S/N) are still lower than other materials. Finally, its advantages, challenges and future prospects are discussed. Overall, this paper provides an opportunity to improve crystal quality, doping regulation and application of TI. Full article
(This article belongs to the Special Issue Materials for Nano/Microelectronic Packaging Applications)
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