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Special Issue "Select Papers from the 21st European Microelectronics and Packaging Conference and Exhibition—EMPC 2017"

A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: 31 January 2018

Special Issue Editors

Guest Editor
Dr. Piotr Jasinski

Gdańsk University of Technology
Website | E-Mail
Interests: sensors; solid oxide fuel cells; electrolyzers
Guest Editor
Prof. Andrzej Dziedzic

Wrocław University of Technology
Website | E-Mail
Interests: thick and thin film technology; sensors

Special Issue Information

Dear Colleagues,

The 21st European Microelectronics and Packaging Conference and Exhibition (EMPC 2017) will be held in Warsaw, Poland, 10–13 September, 2017, and will be devoted to recent developments in the field of microelectronics and packaging technologies, including 3D Integration, Surface Mounted Technology, Chip-on-Board and Flip-Chip Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, Micro-Electro-Mechanical Systems, Photonics, High-Frequency, High-Temperature and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management, Modelling/Design/Simulation, Reliability and Functional Systems. The advances in these fields are driven by increasing demand for high-performance electronics, which pushing the electronics industry to extend technology limits in terms of higher packaging density, lower cost, lighter weight, and greater performance. The materials related aspects in these fields are very crucial to extend the current limits.

This Special Issue selects excellent papers from EMPC 2017 that are related to materials development. The issue will cover the materials oriented scopes of advanced packaging and interconnects, electronic components assembly, printed, hybrid and flexible electronics, thermal management and functional systems. We invite investigators to contribute original research articles, as well as review articles, to this Special Issue.

Dr. Piotr Jasinski
Prof. Andrzej Dziedzic
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Materials for advanced packaging and interconnects
  • Materials for electronic components assembly
  • Materials for printed, hybrid and flexible electronics
  • Materials for thermal management
  • Materials for functional systems.

Published Papers

This special issue is now open for submission.

Journal Contact

MDPI AG
Materials Editorial Office
St. Alban-Anlage 66, 4052 Basel, Switzerland
E-Mail: 
Tel. +41 61 683 77 34
Fax: +41 61 302 89 18
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