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Materials 2018, 11(1), 31; https://doi.org/10.3390/ma11010031

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

Institute of Electronic Appliances and Circuits, University of Rostock, Albert-Einstein-Str. 2, 18059 Rostock, Germany
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Received: 6 November 2017 / Revised: 21 December 2017 / Accepted: 22 December 2017 / Published: 26 December 2017
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Abstract

Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs. View Full-Text
Keywords: thermal management; phase change materials; latent heat; reliability thermal management; phase change materials; latent heat; reliability
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Maxa, J.; Novikov, A.; Nowottnick, M. Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications. Materials 2018, 11, 31.

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