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Special Issue "Science of Landsat Analysis Ready Data"

A special issue of Remote Sensing (ISSN 2072-4292).

Deadline for manuscript submissions: 31 July 2018

Special Issue Editor

Guest Editor
Dr. Zhe Zhu

Department of Geosciences, Texas Tech University, Lubbock, TX, USA
Website | E-Mail
Interests: remote sensing of forest, clouds, urban, and land cover/land use; time series analysis; change detection; climate change

Special Issue Information

Dear Colleagues,

In October 2017, United States Geological Survey (USGS) will release the first version of Landsat Analysis Ready Data (ARD) for the conterminous United States (CONUS) (1982-2017) using Collection 1 Landsat data (https://landsat.usgs.gov/ard), which includes Landsat 4-5 Thematic Mapper (TM) Tier 1 data, Landsat 7 Enhanced Thematic Mapper Plus (ETM) Tier 1 data, and Landsat 8 Operational Land Imager (OLI)/ Thermal Infrared Sensor (TIRS) Tier 1/Tier 2 data. ARD for Alaska and Hawaii will be processed and will be available after CONUS ARD is complete, and eventually global Landsat ARD and Landsat 1-5 Multispectral Sensor (MSS) ARD will also be included in the Landsat ARD products. Landsat ARD are consistently processed to the highest scientific standards and level of processing required for time series analysis. This is another big step after the conversion of all pre-collection data into Collection 1 data. The release of Landsat ARD will make Landsat data much easier to be applied for time series analysis and will open doors in many scientific applications.

This is a very exciting moment for Landsat data users, and we would like to invite you to submit articles about your recent research with respect to the following topics; review articles covering one or more of these topics are also very welcome:

  • Current status and planned/operational Landsat ARD products
  • Specifications and characteristics of Landsat ARD
  • Evaluation of geometric and radiometric accuracies of Landsat ARD
  • Data inter-calibration and creation of long consistent time series (e.g., combination with Sentinel-2)
  • Combined used of Landsat ARD and other sensor data (e.g., Sentinel-2, LIDAR, microwaves, thermal scanners) and fusion approaches.
  • Suitability of Landsat ARD for LCLU mapping and LCLU change detection
  • Suitability of Landsat ARD for assessing vegetation dynamics (phenology, trend, and disturbance)
  • Suitability of Landsat ARD for hazards and disaster monitoring
  • Tools and algorithms for visualizing and analysing Landsat ARD

Dr. Zhe Zhu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Remote Sensing is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Landsat
  • Analysis Ready Data
  • Time Series Analysis
  • Scientific Applications
  • Product

Published Papers

This special issue is now open for submission.
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