E-Mail Alert

Add your e-mail address to receive forthcoming issues of this journal:

Journal Browser

Journal Browser

Special Issue "Electronic Skin and Its Strain Sensing Application"

A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: 31 May 2018

Special Issue Editors

Guest Editor
Assoc. Prof. Senentxu Lanceros-Méndez

BCMaterials, Parque Científico y Tecnológico de Bizkaia, 48160 Derio, Spain
Website | E-Mail
Interests: smart materials; tissue engineering; scaffolds; nanomaterials; functional materials; bone tissue engineering; muscle tissue engineering; bioreactor technology; microenvironments
Guest Editor
Dr. Pedro Costa

Institute for Polymers and Composites IPC/I3N, University of Minho, 4800-058 Guimarães, Portugal and Centro/Departamento de Física, Universidade do Minho, Campus de Gualtar, 4710-057 Braga, Portugal
E-Mail
Interests: smart materials; multifunctional materials; stretchable materials
Guest Editor
Dr. Vítor Manuel Gomes Correia

Centro Algoritmi, Universidade do Minho, Campus Azurém, 4800-058 Guimarães, Portugal and Centro de Física, Universidade do Minho, Campus de Gualtar, 4710-057 Braga, Portugal
E-Mail
Interests: printed technologies; smart surfaces; interface electronics

Special Issue Information

Dear Colleagues,

Electronic skin can be defined as any advanced material or system that mimics human skin functionalities in terms of sensing capabilities. Thus, novel electronic materials and processing technologies are being developed, allowing the implementation of stretching, pressure and/or temperature sensors in a large variety of surfaces. Further, electronic skins are the basis for the development of a wide variety of applications, ranging from robotics to the biomedical field, as well as to the development of novel concepts of multifunctional and interactive surfaces.

It is our pleasure to invite you to submit original research papers, short communications or state-of-the-art reviews within the scope of this Special Issue. Contributions can range from fundamentals, processing and characterization of materials, to innovations in processing technologies or the development of applications.

Prof. Dr. Senentxu Lanceros-Méndez
Dr. Pedro Costa
Dr. Vítor Manuel Gomes Correia
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • smart materials
  • electronic skin
  • strain sensing
  • multifunctional materials
  • smart surfaces

Published Papers

This special issue is now open for submission.

Journal Contact

MDPI AG
Materials Editorial Office
St. Alban-Anlage 66, 4052 Basel, Switzerland
E-Mail: 
Tel. +41 61 683 77 34
Fax: +41 61 302 89 18
Editorial Board
Contact Details Submit to Special Issue Edit a special issue Review for Materials
logo
loading...
Back to Top