Special Issue "Wearable Electronics"
A special issue of C (ISSN 2311-5629).
Deadline for manuscript submissions: 28 February 2018
Prof. Dr. Zhi-Bin Zhang
We are pleased to announce the launch of a Special Issue entitled “Wearable Electronics” in the open access journal, C (ISSN2311-5629, http://www.mdpi.com/journal/carbon). Interest in wearable electronics, that combine sensors and wireless communication to provide accurate and reliable vital information autonomously, has exploded in recent years to enhance safe and healthy living. This will impact a large range of areas, for example, healthcare, environment, security, defence, the economy and energy. Wearable electronics can be used for health monitoring, activity monitoring, disease detection, robotics, robotic surgery, implantable devices, driverless cars, artificial limb and structural monitoring, virtual reality, and augmented reality. Along with the explosion of interest in wearable electronics, a variety of challenges, nonetheless, persist which prevent wearable electronics from becoming a fully commercializable technology. We have seen that extensive research and development has proven carbon-based materials to be promising materials for use in wearable electronics. Non-carbon materials such as liquid alloy are also under exploration for application in wearable devices. As wearable electronics is of a highly interdisciplinary nature, it requires the convergence of many disciplines, notably from materials development, device design and fabrication, device physics, system integration, software and application verification. This Special Issue will be dedicated to providing academic and industrial communities with news of recent advancements in this exciting field. Original articles are welcome and your contribution would greatly enhance this Special Issue by offering different perspectives on this topic.
Prof. Dr. Zhi-Bin Zhang
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. C is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) is waived for well-prepared manuscripts submitted to this issue. Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
• Flexible electronics
• Smart materials
• Carbon electronics
• Printed device
• Sensor networks