Special Issue "Selected Papers from IUMRS-ICEM 2018"

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials".

Deadline for manuscript submissions: 30 September 2018

Special Issue Editors

Guest Editor
Prof. Sarah Eunkyung Kim

Graduate School of Nano-IT Design, Seoul National University of Science and Technology, Seoul, Korea
Website | E-Mail
Interests: microsystems packaging; semiconductor process; transparent material
Guest Editor
Prof. Dr. Caroline Sunyong Lee

Department of Materials Science and chemical Engineering, Hanyang University, Korea
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Interests: electrochromic devices, coating, dry deposition, artificial photosynthesis, semiconductor oxides
Guest Editor
Prof. Dr. Jihwan An

Department of Manufacturing Systems and Design Engineering (MSDE), Seoul National University of Science and Technology, Seoul, Korea
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Interests: thin film energy devices; energy materials; nanotechnology
Guest Editor
Prof. Dr. Jong-Sook Lee

School of Materials Science and Engineering, Chonnam National University
Website | E-Mail
Interests: electroceramics; impedance spectroscopy for energy and electronic applications

Special Issue Information

Dear Colleagues,

The International Union of Materials Research Society—International Conference on Electronic Materials 2018 will be held 19–24 August, 2018, at the Daejeon Convention Center in Daejeon, Korea. IUMRS-ICEM is a continuation in a series of conferences of international MRS members.

This Special Issue on “Selected Papers from IUMRS-ICEM 2018” is expected to select excellent papers presented at IUMRS-ICEM 2018 on electronic materials, 2D materials, soft electronics, functional materials, energy and energy storage, bio-engineering, and emerging advanced materials. This conference has become a fundamental ground to exchange quality results and ideas provided by the researchers and scientists from universities, industry and institutes. Furthermore, it also provides a forum to present cutting-edge research outputs for future collaborations, which would help both students and researchers within their future research studies and works.

The main goal of this Special Issue, “Selected Papers from IUMRS-ICEM 2018”, is to discover new scientific knowledge relevant to electronic materials, 2D materials, soft electronics, functional materials, energy and energy storage, bio-engineering, and emerging advanced materials.

We cordially invite researchers from the conference who would like to publish their original research articles in this Special Issue.

Prof. Dr. Sarah Eunkyung Kim
Prof. Dr. Caroline Sunyoung Lee
Prof. Dr. Jihwan An
Prof. Dr. Jong-Sook Lee
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (1 paper)

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Research

Open AccessArticle Synthesis of Thermally Stable Reactive Polyurethane and Its Physical Effects in Epoxy Composites
Appl. Sci. 2018, 8(9), 1587; https://doi.org/10.3390/app8091587
Received: 19 July 2018 / Revised: 16 August 2018 / Accepted: 5 September 2018 / Published: 7 September 2018
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Abstract
A flame retardant polyol (EP-DOPO) with epoxy functional groups was synthesized by reacting a 1,6-hexanediol glycidyl ether with a flame retardant 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phospha-phenanthrene-10-oxide (DOPO). The polyurethane (EPPU) with enhanced heat resistance was prepared by the reaction of a polyol blend of EP-DOPO
[...] Read more.
A flame retardant polyol (EP-DOPO) with epoxy functional groups was synthesized by reacting a 1,6-hexanediol glycidyl ether with a flame retardant 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phospha-phenanthrene-10-oxide (DOPO). The polyurethane (EPPU) with enhanced heat resistance was prepared by the reaction of a polyol blend of EP-DOPO and polytetrahydrofuran (PolyTHF) at a ratio of 1:1 with isophorone diisocyanate. EPPU useful for the preparation of cables or coatings showed higher thermal decomposition temperature rather than that of reference polyurethane synthesized by the reaction between pure PolyTHF and isophorone diisocyanate by thermogravimetric analysis. Further study of the polyurethane as a toughening agent for epoxy polymers was carried out. Epoxy compositions consisting of bisphenol A epoxy resin and dicyandiamide as a hardener have a brittle property allowing crack propagation after cure. Polyurethane plays an important role as an impact modifier to prevent from cracks of epoxy polymers. Various contents of EPPU were added into epoxy compositions to measure the physical property changes of epoxy polymers. The tensile and flexural strengths of the cured specimen were compared with those of epoxy compositions including reference polyurethane. Furthermore, the crosslink density of the cured epoxy compositions was compared. Full article
(This article belongs to the Special Issue Selected Papers from IUMRS-ICEM 2018)
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