Special Issue "Packaging Films"

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A special issue of Polymers (ISSN 2073-4360).

Deadline for manuscript submissions: 31 March 2015

Special Issue Editor

Guest Editor
Prof. Dr. Taek-Soo Kim
Department of Mechanical Engineering, KAIST, Daejeon 305-701, Korea
Website: http://aptf.kaist.ac.kr/
E-Mail: tskim1@kaist.ac.kr
Interests: mechanics-related subjects of advanced packaging and thin films: adhesion; deformation; fracture; fatigue; reliability; and stress/strain induced multiphysics phenomena

Special Issue Information

Dear Colleagues,

Packaging films are essential for maintaining the integrity of a variety of products, which range from foods to cutting-edge electronics, such as flexible OLED displays. In particular, the advent of flexible electronics requires further innovations in packaging films, including the development of the polymer flexible substrate. For example, in the case of flexible OLED displays, the rate of permeation for water must be lower than 10−6 g/m2/day; this is an extremely low penetration rate  (compared to other applications). Even the usage of graphene as the packaging film has to meet the ultimate requirements of permeability, flexibility, transparency, thickness, and stability. This Special Issue of Polymers will cover the whole line of recent research involved in advanced packaging film synthesis, integration, integrity tests, and more.

Prof. Dr. Taek-Soo Kim
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed Open Access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs).


Keywords

  • packaging films
  • polymer substrates
  • multilayer nanocomposite films
  • encapsulation
  • permeability
  • adhesion
  • flexible electronics

Published Papers (1 paper)

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p. 2386-2403
by , , , , , ,  and
Polymers 2014, 6(9), 2386-2403; doi:10.3390/polym6092386
Received: 7 July 2014; in revised form: 20 August 2014 / Accepted: 2 September 2014 / Published: 19 September 2014
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(This article belongs to the Special Issue Packaging Films)
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Last update: 16 September 2014

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