Brazing and Soldering of Metallic Materials

Dear Colleagues,

Brazing, soldering, and transient liquid phase (TLP) bonding are important joining methods for the weldments that are difficult to join using traditional arc welding, especially for pieces of ultra size (e.g., too small, too large, too thin, too thick) and with a special composition sensitive to defects and poor phase generated at high temperature and solidification. For joining dissimilar metals and advanced materials (e.g., metal matrix composite), brazing, soldering, and TLP bonding have become essential joining methods.

In this Special Issue on brazing, soldering, and TLP bonding, articles addressing new joining process development, new design routes of brazing filler metal, soldering filler metal, and interlayers are invited. Also, articles about the characterization and analysis of wetting behavior, interfacial microstructure evolution, inhibition of intermetallic compounds and thermal stress are welcome.

Prof. Dr. Gui-Feng Zhang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• brazing
• soldering
• transient liquid phase (TLP) bonding
• interlayer
• filler metal design
• wettability
• oxide film removal
• interface reaction
• intermetallic compounds
• dissimilar metals
• friction stir brazing