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Special Issue "Photonic Materials and Applications 2013"

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A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: closed (30 June 2013)

Special Issue Editor

Guest Editor
Prof. Dr. Mitsuteru Inoue (Website)

Toyohashi University of Technology, Hibari-ga-oka 1-1, Tempaku, 441-8580, Toyohashi, Aichi, Japan
Interests: magnetics-based functional materials developments, such as magnetophotonic crystals, nano-composite materials, and their applications such as holographic data storage, optical switches, spatial light modulators, unwire SAW sensing system, 3D display

Special Issue Information

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed Open Access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs).

Published Papers

No papers have been published in this special issue yet.

Journal Contact

MDPI AG
Materials Editorial Office
St. Alban-Anlage 66, 4052 Basel, Switzerland
materials@mdpi.com
Tel. +41 61 683 77 34
Fax: +41 61 302 89 18
Editorial Board
Contact Details Submit to Materials
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