Special Issue "Construction Materials"
Deadline for manuscript submissions: closed (28 February 2014)
Dr. En-Hua Yang
School of Civil and Environmental Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
Fax: +65 6791 0676
Construction materials are the most used materials in human history. They represent an enormous investment of raw materials, energy, and capital, and result in significant environmental burdens and social costs. Innovative technologies have been developed continuously to improve the chemical, physical, and mechanical properties, durability, and sustainability of construction materials. Recently, smart construction materials with special functionalities such as self-sensing and self-healing have drawn great attention and interest to the community. This special issue of Materials invites original research articles and comprehensive reviews on advances in construction materials which include, but are not limited to: cement, concrete, cement-based composites, additives, bricks, steel, timber, glass, and polymers.
Dr. En-Hua Yang
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed Open Access monthly journal published by MDPI.