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Crystalline Silicon Solar Cells: Fundamentals and Technologies

A special issue of Energies (ISSN 1996-1073).

Deadline for manuscript submissions: closed (15 March 2017) | Viewed by 5667

Special Issue Editor


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Guest Editor
Electronic Engineering Department, Polytechnic University of Catalonia, building C4, office 007, C/Jordi Girona 1-3, 08034 Barcelona, Spain
Interests: photovoltaics; solar cells; crystalline silicon; surface passivation

Special Issue Information

Dear Colleagues,

Crystalline silicon photovoltaics have been dominating the market related to terrestrial applications since their appearance. This dominant position is based on a continuous development of new technologies that have paved the way to cost reduction and/or efficiency improvement. As a result, a vast scientific community is working on every step of the R+D chain, from the revolutionary concepts to further optimization of the well-stablished industrial processes. The Special Issue, “Crystalline Silicon Solar Cells: Fundamentals and Technologies” tries to call the attention of this scientific community.

The scope of this Special Issue could include investigations in different areas at both laboratory—and industrial-scale, such as:

  • Crystalline silicon material properties for photovoltaic applications: monocrystalline, multicrystalline and mono-like substrates, contaminant contents, thermal donors, ultra-thin silicon substrates.

  • Surface processing: Cleaning procedures, surface texturization, black silicon.

  • Selective contacts formation: p/n junctions, silicon heterojunctions, transition metal oxides contacts, tunneling oxide contacts.

  • Crystalline silicon surface passivation: Fundamentals, interface characterization techniques, dielectric film characterization, thermal stability.

  • Contact formation: contact resistance, metal patterning, performance of screen-printing pastes, self-aligned contacts, electroplating, Transparent Conductive Oxides (TCOs).

  • Laser applications to device fabrication: Laser doping, selective emitter formation, dielectric ablation, laser patterning, edge isolation.

  • Numerical Simulations: Device simulation, updated models for fundamental characteristics, optical models.

  • New solar cell architectures: Double-side contacted, interdigitated back contacted, emitter and metal-wrap through solar cells, tandem solar cells.

Prof. Dr. Isidro Martín Garcia
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Photovoltaics

  • solar cells

  • crystalline silicon

  • material quality

  • surface passivation

  • contact formation

  • laser applications

  • numerical simulations

Published Papers (1 paper)

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Research

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Article
Characterization of the Diamond Wire Sawing Process for Monocrystalline Silicon by Raman Spectroscopy and SIREX Polarimetry
by Sindy Würzner, Martin Herms, Thomas Kaden, Hans Joachim Möller and Matthias Wagner
Energies 2017, 10(4), 414; https://doi.org/10.3390/en10040414 - 23 Mar 2017
Cited by 15 | Viewed by 5214
Abstract
A detailed approach to evaluate the sub-surface damage of diamond wire-sawn monocrystalline silicon wafers relating to the sawing process is presented. Residual stresses, the presence of amorphous silicon and microcracks are considered and related to diamond wire velocity and cutting ability. In particular, [...] Read more.
A detailed approach to evaluate the sub-surface damage of diamond wire-sawn monocrystalline silicon wafers relating to the sawing process is presented. Residual stresses, the presence of amorphous silicon and microcracks are considered and related to diamond wire velocity and cutting ability. In particular, the degree of amorphization of the wafer surface is analyzed, as it may affect the etching performance (texturing) during solar cell manufacture. Raman spectroscopy and Scanning Infrared Stress Explorer (SIREX) measurements are used independently as non-destructive, contactless optical characterization methods to provide stress imaging with high spatial resolution. Raman mappings show that amorphous silicon layers can occur inhomogeneously across the surface of diamond wire-sawn wafers. The Raman and SIREX results reveal a connection between a higher fraction of the amorphous phase, a more inhomogeneous stress distribution and a lower peak maximum of the stress difference on wafers, depending on both the wire wear and the wire velocity. SIREX line scans of the in-plane difference of the principal stress components ∆σ taken across the sawing grooves show significant differences in magnitude and periodicity. Furthermore, the results are compared with the microcrack depth from the same investigation areas. The possibility to optimize the diamond wire sawing processes by analyzing the sub-surface stress of the wafers is offered by complementary use of both Raman and SIREX measurements. Full article
(This article belongs to the Special Issue Crystalline Silicon Solar Cells: Fundamentals and Technologies)
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