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Electronics
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Polyphase Insulation and Discharge in High-Voltage Technology
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Polyphase Insulation and Discharge in High-Voltage Technology

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Power Electronics".

Deadline for manuscript submissions: 15 May 2024 | Viewed by 641

Special Issue Editors

Dr. Wendong Li

E-Mail Website
Guest Editor
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an 710049, China
Interests: solid insulation with high reliability; aging process of insulation material
Dr. Junbo Deng

E-Mail Website
Guest Editor
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an 710049, China
Interests: gas/solid insulation and interfacial discharge; transients in complex power system
Dr. Daning Zhang

E-Mail Website
Guest Editor
State Key Laboratory of Electrical Insulation and Power Equipment, Xi’an Jiaotong University, Xi’an 710049, China
Interests: solid/liquid insulation; diagnosis of high voltage equipment

Special Issue Information

Dear Colleagues,

High-voltage devices, such as power system transformers, gas-insulated switching devices, power cable systems, and high-voltage power electronic components, play a pivotal role in the realms of electric and electronic engineering. The dire requirement for mechanical support and for isolation among distinct gas or liquid chambers necessitate the adoption of polyphase insulation structures within these devices. These structures encompass gas–solid, liquid–solid, or solid–solid interfaces with diverse materials or phases. Moreover, advantages such as compact geometry and better cooling also encourage researchers and engineers to design and incorporate polyphase insulation structures into their novel prototypes. However, there are several issues in the R&D of polyphase insulation structures: (1) Polyphase insulation structures are susceptible to dielectric mismatches at their interfaces, which can initiate partial discharges within the insulation system, thereby compromising breakdown voltage and the remaining operational lifespan. (2) The electrical, mechanical, and thermal properties within polyphase insulation structures exhibit significant disparities to the homogeneous ones, posing intricate challenges in the design, monitoring, and diagnostic processes. (3) An emerging topic in polyphase discharge is the utilization of interfacial-generated plasma, which require investigations on fundamental characteristics and potential applications.

Given this context, this Special Issue of the journal Electronics, ‘Polyphase Insulation and Discharge in High-Voltage Technology,’ aims to act as a catalyst in fostering a comprehensive understanding of the aforementioned issues. We cordially invite submissions of peer-reviewed, high-quality research papers pertaining to polyphase insulation structures and associated discharge phenomena, which offer invaluable insights into the design, fabrication, utilization, and evaluation of polyphase insulation structures with heightened reliability and enhanced functionality.

We welcome submissions of original research articles and reviews in areas including (but not limited to) the following:

  • Novel design methods of polyphase insulation structures;
  • Electrical, mechanical, and thermal properties of polyphase dielectrics;
  • Fundamental characteristics of polyphase discharge and resultant plasma;
  • Innovative diagnosis methods of polyphase insulation structures;
  • Simulation and experimental approaches for polyphase insulation;
  • Utilization of advanced polyphase insulation in high voltage technology.

Dr. Wendong Li
Dr. Junbo Deng
Dr. Daning Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electrical insulation
  • polyphase structure
  • material properties
  • discharge phenomenon
  • monitoring and diagnosis
  • high voltage technology

Published Papers (1 paper)

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Research

17 pages, 3019 KiB  
Article
Characteristics of Surface Charge Accumulation on Spacers and Its Influencing Factors
by Yundong Lai, Hui Jiang, Yufei Han and Jinyu Tang
Electronics 2024, 13(7), 1294; https://doi.org/10.3390/electronics13071294 - 30 Mar 2024
Viewed by 396
Abstract
Charge accumulation usually happens on the surface of spacers under DC operation, which is susceptible to inducing surface flashover. In order to explore the surface charge accumulation mechanisms and the influences of dielectric conductivity, gas ion mobility, and temperature field on the surface [...] Read more.
Charge accumulation usually happens on the surface of spacers under DC operation, which is susceptible to inducing surface flashover. In order to explore the surface charge accumulation mechanisms and the influences of dielectric conductivity, gas ion mobility, and temperature field on the surface charges, a time-varying charge density model at the gas–solid interface of spacers was established. The results of the simulation show that the discontinuity of the current density between the spacer bulk side and the gas ion flow is the fundamental reason for the charge accumulation on the spacer surface. Additionally, the value of current density fluxes at the interface continues to decrease with the change of the electric field, and the progress of charge transfer gradually stabilizes. Moreover, the dielectric conductivity directly affects the charge accumulation process, and there is a critical conductivity in which the effect of charge conduction in dielectrics counteracts that of gas-phase charge deposition, theoretically. When the conductivity is higher than the critical conductivity, the solid-side charge conduction is the main source of the surface charge accumulation, while the gas-phase charge deposition on the gas side plays a dominant role when the conductivity is lower than the critical conductivity. The charge accumulation is not significantly affected by gas ion mobility when the temperature is evenly distributed. However, under the temperature field with gradient distribution, the current density fluxes at the interface change, causing the polarity reverse of the accumulated charge. In the high-temperature region, the volume current density surges simultaneously with the conductivity, leading to a higher density of surface charge accumulation. Lastly, the design of spacers needs to keep the current densities on both sides of the interface as similar as possible in order to avoid excessive charge gathering in localized areas. Full article
(This article belongs to the Special Issue Polyphase Insulation and Discharge in High-Voltage Technology)
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