Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
4.7
2.9
Journals
Electronics
Special Issues
High Power Density Power Electronics
share announcement

High Power Density Power Electronics

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Power Electronics".

Deadline for manuscript submissions: 15 September 2024 | Viewed by 1857

Special Issue Editors

Dr. Hongchang Li

E-Mail Website
Guest Editor
School of Electrical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
Interests: high frequency power conversion; wireless power transfer; modulation and control
Prof. Dr. Jingyang Fang

E-Mail Website
Guest Editor
School of Control Science and Engineering, Shandong University, Jinan 250061, China
Interests: power electronics; power systems; digital control; energy storage; renewable energies; stability and power quality of grid-tied power converters
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

With the application of wide bandgap semiconductors, the switching frequency and power density of power electronic converters are expected to be greatly improved. However, at the same time, the influence of parasitic parameters in the circuit is more significant, and the optimization of the switching process becomes more complicated; the magnetic components such as inductors and transformers in the circuit become the bottleneck to improving the efficiency and power density of the converter, and new designs are required to meet the requirements. Higher power density also requires higher conversion efficiency and heat dissipation capability, so high-frequency soft switching technology and advanced thermal management technology are particularly important.

The purpose of this Special Issue is to provide an opportunity for researchers to share their creative solutions and inspiring ideas to the challenges of high power density converters

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:

  • Integration technology of wide bandgap devices;
  • Integrated current sensing, protection, and control;
  • High frequency soft switching techniques;
  • High power density magnetic devices;
  • Advanced thermal management;
  • New topologies and applications.

Dr. Hongchang Li
Prof. Dr. Jingyang Fang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • wide bandgap devices
  • magnetic devices
  • power density
  • soft switching
  • thermal management

Published Papers (2 papers)

Download All Papers
Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

21 pages, 7238 KiB  
Article
Research on Magnetic-Thermal-Force Multi-Physical Field Coupling of a High-Frequency Transformer with Different Winding Arrangements
by Bofan Li, Pengning Zhang, Pengyang Li, Ze Liu, Wei Li and Jian Zhang
Electronics 2023, 12(24), 5008; https://doi.org/10.3390/electronics12245008 - 14 Dec 2023
Viewed by 569
Abstract
In order to clarify the magnetic-thermal-force changing rule of high-frequency transformers under different winding arrangements, this paper tests the magnetization and loss characteristics of nanocrystalline materials at different temperatures, and based on the magnetization and loss data, establishes a magnetic-thermal-force coupling calculation model [...] Read more.
In order to clarify the magnetic-thermal-force changing rule of high-frequency transformers under different winding arrangements, this paper tests the magnetization and loss characteristics of nanocrystalline materials at different temperatures, and based on the magnetization and loss data, establishes a magnetic-thermal-force coupling calculation model of 15 kVA, 5 kHz nanocrystalline high-frequency transformers, and calculates and analyzes the magnetic flux density, loss and temperature rise distributions of high-frequency transformers with three different winding arrangements under no-load and short-circuit conditions, respectively. Through comparative analysis, it was found that under no-load conditions, the cross-transposition of winding has less influence on the magnetic flux of the high-frequency transformer core, but it can reduce the iron-core loss and transformer temperature rise. The cross-transposition of winding under short-circuit conditions can significantly reduce the leakage magnetic field strength of high-frequency transformers; complete cross-transposition weakens the high-frequency transformer losses and temperature rise better than partial cross-transposition. According to the winding current density and core leakage field distribution under short-circuit conditions, we calculated and analyzed the distribution of its the axial and radial electromagnetic forces. The results show that the axial electromagnetic force causes the winding to be squeezed from both ends to the middle, the radial electromagnetic force causes the primary winding to shrink inward and the secondary winding to expand outward, so cross-transposition can greatly reduce electromagnetic force and weakening the deformation of the winding. Therefore, high-frequency transformers of winding cross-transposed should be used in actual projects to reduce transformer temperature rise and improve efficiency and security. This research has theoretical significance for the multi-physical field coupling of high-frequency transformers and its structural design. Full article
(This article belongs to the Special Issue High Power Density Power Electronics)
►▼ Show Figures

Figure 1

17 pages, 1463 KiB  
Article
Design and Implementation of Automatic Cooling Case Based on High-Power and High-Density Power Supply Array
by Zerui Chen, Hangwei Feng, Guoguang Zhang and Chong Yang
Electronics 2023, 12(20), 4353; https://doi.org/10.3390/electronics12204353 - 20 Oct 2023
Viewed by 846
Abstract
Multi-board electronic cases with high-density and power modules are widely used in industrial power supply management. Heat dissipation becomes an important factor in the design process in improving case performance and miniaturization requirements. The design of existing small electronic thermal methods ignores high-temperature [...] Read more.
Multi-board electronic cases with high-density and power modules are widely used in industrial power supply management. Heat dissipation becomes an important factor in the design process in improving case performance and miniaturization requirements. The design of existing small electronic thermal methods ignores high-temperature and high-load environment tests without automation control. To solve these problems, a heat dissipation case is designed with a magnesium and aluminum alloy, for intelligent temperature control based on a high-power and high-density power supply array. Based on the extreme miniaturization design principle, a composite heat dissipation mode is adopted based on conduction and supplemented by forced air cooling. The results show that the heat dissipation design in this article can work normally in high-temperature and high-load environment tests. Finally, the existing cooling designs are compared and analyzed. The cooling performance parameters in this article are better than those in the existing case. It contributes to the thermal design of miniaturized electronic cases in power supply management. Full article
(This article belongs to the Special Issue High Power Density Power Electronics)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-2
Back to TopTop