Next Article in Journal
Review of Microfluidic Photobioreactor Technology for Metabolic Engineering and Synthetic Biology of Cyanobacteria and Microalgae
Next Article in Special Issue
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Previous Article in Journal
Continuously Operating Biosensor and Its Integration into a Hermetically Sealed Medical Implant
Previous Article in Special Issue
Novel Capacitive Sensing System Design of a Microelectromechanical Systems Accelerometer for Gravity Measurement Applications
Article Menu

Export Article

Open AccessArticle
Micromachines 2016, 7(10), 184; doi:10.3390/mi7100184

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

1
Department of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku University, 6-6-12 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Miyagi, Japan
2
New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Miyagi, Japan
3
Tohoku-MicroTec Co., Ltd., 6-6-12 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
4
Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Sendai 980-8579, Miyagi, Japan
5
Department of Biomedical Engineering, Graduate School of Biomedical Engineering, Tohoku University, Sendai 980-8579, Miyagi, Japan
*
Author to whom correspondence should be addressed.
Academic Editors: Nam-Trung Nguyen, Frank Niklaus and Roy Knechtel
Received: 1 July 2016 / Revised: 9 September 2016 / Accepted: 27 September 2016 / Published: 10 October 2016
(This article belongs to the Special Issue 3D Integration Technologies for MEMS)
View Full-Text   |   Download PDF [4173 KB, uploaded 10 October 2016]   |  

Abstract

Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In this study, chemical mechanical polish (CMP)-treated oxide formed by plasma-enhanced chemical vapor deposition (PE-CVD) as a MCtW bonding interface was mainly employed, and in addition, wafer-to-wafer thermocompression direct bonding was also used for comparison. N2 or Ar plasmas were utilized for the surface activation. After plasma activation and the subsequent supplying of water as a self-assembly mediate, the chips with the PE-CVD oxide layer were driven by the liquid surface tension and precisely aligned on the host wafers, and subsequently, they were tightly bonded to the wafers through the MCtW oxide-oxide direct bonding technology. Finally, a mechanism of oxide-oxide direct bonding to support the previous models was discussed using an atmospheric pressure ionization mass spectrometer (APIMS). View Full-Text
Keywords: multichip-to-wafer; direct bonding; capillary self-assembly; liquid surface tension; 3D integration; CMP; heterogeneous integration multichip-to-wafer; direct bonding; capillary self-assembly; liquid surface tension; 3D integration; CMP; heterogeneous integration
Figures

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Fukushima, T.; Hashiguchi, H.; Yonekura, H.; Kino, H.; Murugesan, M.; Bea, J.-C.; Lee, K.-W.; Tanaka, T.; Koyanagi, M. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 2016, 7, 184.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Micromachines EISSN 2072-666X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top