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Micromachines 2014, 5(3), 486-495;

UV-LIGA: From Development to Commercialization

Mimotec SA, Route des Iles 20, CH-1950 Sion, Switzerland
Author to whom correspondence should be addressed.
Received: 17 June 2014 / Revised: 14 July 2014 / Accepted: 15 July 2014 / Published: 23 July 2014
(This article belongs to the Special Issue 15 Years of SU8 as MEMS Material)
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A major breakthrough in UV-LIGA (Lithographie, Galvanoformung and Abformung) started with the use of epoxy-based EPON® SU-8 photoresist in the mid-1990s. Using this photoresist has enabled the fabrication of tall and high aspect ratio structures without the use of a very expensive synchrotron source needed to expose the photoresist layer in X-ray LIGA. SU-8 photoresist appeared to be well-suited for LIGA templates, but also as a permanent material. Based on UV-LIGA and SU-8, Mimotec SA has developed processes to manufacture mold inserts and metallic components for various market fields. From one to three-level parts, from Ni to other materials, from simple to complicated parts with integrated functionalities, UV-LIGA has established itself as a manufacturing technology of importance for prototyping, as well as for mass-fabrication. This paper reviews some of the developments that led to commercial success in this field. View Full-Text
Keywords: UV-LIGA; SU-8; thick photoresist; micro-components; high aspect ratio; CLR-LIGA (covert laser readable-LIGA) UV-LIGA; SU-8; thick photoresist; micro-components; high aspect ratio; CLR-LIGA (covert laser readable-LIGA)

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Genolet, G.; Lorenz, H. UV-LIGA: From Development to Commercialization. Micromachines 2014, 5, 486-495.

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